Industry News | 2019-11-05 12:11:26.0
ITW EAE is introducing the MPM® Momentum II™ Printer as the next generation of the highly successful Momentum printer line. The Momentum II features a new set of enhanced technologies that bring further advancement in quality, yield, productivity, ease of use and flexibility.
Industry News | 2022-10-12 07:22:35.0
I.C.T As an SMT Factory Solution Partner, Mainly Provide Full SMT Line Machine. Including SMT Pick and Place Machine, PCB Reflow Oven, SMT Stencil Printer, PCB Wave Soldering Machine, PCB Handing Machine and SMT Peripheral Equipment for Global Customers.
Industry News | 2014-09-16 11:25:27.0
The Surface Mount Technology Association (SMTA) announced today that Professor Ronald Lasky, Ph.D., Dartmouth College/Indium Corporation and Jim Hall, ITM Consulting, will be available in the SMTA BookStore on Wednesday, October 1 from 12:30pm to 1:30pm for a book signing.
Industry News | 2016-08-03 20:48:00.0
The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road,Laurel, MD 20723, on Tuesday, August 30th.
Industry News | 2023-10-23 09:44:34.0
Changes address advances in rigid printed board fabrication processes
Industry News | 2011-07-26 22:29:00.0
It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
Industry News | 2010-11-18 11:21:04.0
IPC has released the training and certification programs for revision E of IPC-A-610, Acceptability of Electronics Assemblies, and J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2016-09-11 12:12:28.0
SMTA China announces that it presented awards for seven papers at the SMTA China 10th Anniversary Reception, held on Tuesday, August 30, 2016 at Shenzhen Convention & Exhibition Center in conjunction with the NEPCON South China Show.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
