Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Fri Jan 14 08:36:33 EST 2000 | Wolfgang Busko
Yes selective gold might be a cost factor. How about the whole board in Ni/Au that�s what we do with no difference in costs to HASL or white tin. But maybe the pricing in Germany is different than in other places. Can�t say what�s the best for you bu
Electronics Forum | Wed May 13 14:22:17 EDT 1998 | JoSi
Hi, There has been a lot of disputes in our company about changing present HASL to another Finishing which can provide more flatter pad surface in fine pitch applications. ( perhaps Ni/Au, OSP ) The target is to reduce solder defects, thus improve
Electronics Forum | Mon Apr 28 16:36:11 EDT 2003 | razor
Component: Termination (barrier) NI, 120/3.0 um Solder Plate (outer) 90% Sn, 10% Pb, 120/3.0 um Solder: Multicore CR39, 95.5%Sn/3.8%Ag/.7%Cu @ 6mil Flex PCB: Cu, Ni, Au .2m to .5m Thanks
Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef
ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take
Electronics Forum | Fri Oct 14 14:00:35 EDT 2005 | patrickbruneel
Mika, If I understand you correctly you compare hole fill of Ni/Au plated boards in a lead-free process with HASL 63/37 boards soldered with leaded solder. If this is the case you might be facing the challenges in Pb free wave soldering with the lim
Electronics Forum | Sun Sep 07 17:16:57 EDT 2008 | gregoryyork
OK Pizza it is then, here goes. Dewetting of Ni/Au pads, paste favouring the Tinned component lead hence excess paste wicking on top of the components. Reason is EITHER Nickel migration into the gold due to high levels of Ionics from poor rinse OR mo
Electronics Forum | Mon Dec 20 16:22:45 EST 2010 | rkondner
When you say Fine Pitch is this .5mm or is it smaller? I wonder what problems they experienced with HASL, the only problem I recall hearing was the surface was not flat. When applying paste with a stencil I can not see how the flatness is an issue.
Electronics Forum | Tue Dec 21 12:28:27 EST 2010 | wrongway
I know when we used them we had problems when one pad is 7 mils tall nest to a flat pad one lead touches the pad the lead next to it isnt touching anything so then have an open I don't see how anybody dosnt have problems with it that use quad flatpa
Electronics Forum | Tue Jan 04 10:37:48 EST 2011 | johanhuizing
Hi Mike, We only are using ENIG not hard gold, we are using edge contacts but the connectors will only be removed if the product is being replaced, normal life time for the equipment where the electronics is build-in is 15 years. Also the electronic
