Industry News | 2023-09-11 16:43:37.0
KYZEN is excited to announce its participation in the upcoming SMTA International Exposition. The exhibition is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN, where KYZEN will showcase its latest breakthrough cleaning chemistry – AQUANOX® A4618 with Process Control in Booth #1501.
Industry News | 2012-03-28 15:59:44.0
Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.
Industry News | 2019-04-03 20:07:41.0
Practical Components is a leading international distributor of mechanical IC samples or “dummy” components that has added a new SMTA Solder Paste Test Vehicle for Miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
Industry Directory | Manufacturer
New England CM is a contract manufacturer for high speed assembly of SMT and mixed technology PCBs specializing in prototype and medium production runs.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Used SMT Equipment | Soldering - Wave
Vitronics Soltec 6622CC Wave Soldering Machine (Pb Free) (2006) Brand: Vitronics Model: Soltec 6622CC Type: Wave Soldering Machine (Pb Free) Year: 2006 Serial #: 0603804401 Machine Specifications: Top preheat: Zone 2 and 3 top side Calrod
Used SMT Equipment | Soldering - Wave
Vitronics Soltec Delta 5 Wave Soldering Machine (Pb-free)(2008) Brand: Vitronics Soltec Model: Delta 5 Year: 2008 Serial #: 0890070 Type: Wave soldering machine Machine specifications: Lambda (main) wave Rotary (smart) wave Chip wave Flu
