Industry News | 2021-01-30 07:00:01.0
MacDermid Alpha Electronics Solutions announces the release of STAYDRY® H2-3000PSA, a hydrogen and moisture getter for hermetic packages. STAYDRY H2-3000PSA adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting Mil-STD-883K, Method 5011.6 and NASA ASTM E595 requirements.
New Equipment | Surface Finish
The Minilock-Phantom is the first RIE system in the industry to incorporate a vacuum load-lock on a compact platform. The system has been designed to meet all the safety and equipment needs for the most challenging processes including etch applicatio
New Equipment | Test Equipment
HAST (Highly Accelerated Stress Test) reduces the time it takes to complete humidity testing most commonly used for semiconductors. HAST Tests can be completed in days, not weeks. Any testing process that requires humidity testing may benefit from sw
Industry News | 2010-12-09 13:15:01.0
STI Electronics announces that Casey Cooper, Electrical Engineering/Microelectronics Lab Manager, will present "Conformal Coating Evaluation for Use in Harsh Environments Utilizing a Modified SIR Test Protocol" at the upcoming Pan Pacific Microelectronics Symposium & Tabletop Exhibition, scheduled to take place January 18-20, 2011at the Hapuna Beach Prince Hotel on the Big Island of Hawaii.
Industry News | 2011-12-19 17:19:52.0
SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces key events to further the industry’s knowledge base.
Industry News | 2018-03-24 09:45:36.0
Dendrite failure on printed circuit board assemblies is quite common but often not investigated fully to pin point the root cause. This is due to the intermittent nature of the failure or just replacing components seems to solve the problem Book at https://www.bobwillis.co.uk/event/dendrite-failure-causes-cures/
Industry News | 2016-10-21 09:09:56.0
Bob Willis provides the widest monthly selection of education events in industry direct to your conference room. If you don't see what you need just ask
Industry News | 2017-10-23 05:53:04.0
Selected Bob Willis webinars are released for the end of 2017 and the beginning of 2018. Book online to secure your place or for your team training. If the date or time does not suit your schedule its also possible to arrange online training at a time and date that is better for you http://www.bobwillis.co.uk
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
Technical Library | 2023-03-16 18:51:43.0
Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper containing filament subsurface along the epoxy-glass interface, from anode to cathode. Despite the projected lifetime reduction due to CAF, field failures were not identified in the 1980s. Recently, however, field failures of critical equipment have been reported.2 A thorough understanding of the nature of CAF is needed in order to prevent this catastrophic failure from affecting electronic assemblies in the future. Such an understanding requires a comprehensive evaluation of the factors that enhance CAF formation. These factors can be grouped into two types: (1) internal variables and (2) external influences. Internal variables include the composition of the circuit board material, and the conductor metallization and configuration (i.e. via to via, via to surface conductor or surface conductors to surface conductors). External influences can be due to (1) production and (2) storage and use. During production, the flux or hot air solder leveling (HASL) fluid choice, number and severity of temperature cycles, and the method of cleaning may influence CAF resistance. During storage and use, the principal concern is moisture uptake resulting from the ambient humidity. This paper will report on the relationship between these various factors and the formation of CAF. Specifically, we will explore the influences of printed wiring board (PWB) substrate choice as well as the influence of the soldering flux and HASL fluid choices. Due to the ever-increasing circuit density of electronic assemblies, CAF field failures are expected to increase unless careful attention is focused on material and processing choices.
