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Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Surface Mount Technology Association (SMTA)

Non-Destructive Test Methods

Technical Library | 2019-09-23 09:35:00.0

Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).

ACI Technologies, Inc.

Nordson Asymtek Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine

Nordson Asymtek Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine

Used SMT Equipment | X-Ray Inspection

Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Vintage: Year 2014 PCB Direction: Left to Right Condition: Refurbished, working Running Hours: Series Number:X215914 Missing Parts: No Warra

Qinyi Electronics Co.,Ltd

Europe Chapter Webinar: Testing Coatings of Electronic Assemblies - Reliability is No Coincidence

Events Calendar | Wed May 12 00:00:00 EDT 2021 - Wed May 12 00:00:00 EDT 2021 | ,

Europe Chapter Webinar: Testing Coatings of Electronic Assemblies - Reliability is No Coincidence

Surface Mount Technology Association (SMTA)

IPC Announces Fall Webinar Schedule

Industry News | 2011-10-21 14:11:44.0

Offering a cost-effective and convenient way to train employees on timely industry topics, IPC webinars deliver one hour of trusted education to the comfort of companies’ conference rooms. Focused on technical, practical and management issues facing the electronics industry, these sessions are based on award-winning technical papers from IPC APEX EXPO® 2011

Association Connecting Electronics Industries (IPC)

PCB Reverse Engineering Services

PCB Reverse Engineering Services

New Equipment | Design Services

ACI offers a full range of customized reverse engineering services and support at the the component, board, and system levels. Our engineers have years of experience analyzing and designing products, parts and assemblies, acquired from various rever

ACI Technologies, Inc.

IPC News: IEC Electronics Corp. First to Earn Certification as Qualified Manufacturer to IPC/WHMA-A-620

Industry News | 2014-11-12 14:02:55.0

IPC’s Validation Services Program has awarded the first IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) to IEC Electronics Corporation’s Newark, New York and Albuquerque, New Mexico locations; and Southern California Braiding facility in Bell Gardens, California.

Association Connecting Electronics Industries (IPC)

Nordson DAGE X-RAY XD7500

Nordson DAGE X-RAY XD7500

Used SMT Equipment | X-Ray Inspection

• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st

Qinyi Electronics Co.,Ltd

Four Industry Leaders Receive IPC President’s Award

Industry News | 2020-02-18 14:13:29.0

Michael Ford, Dale Lee, Joe O’Neil and S. Manian Ramkumar honored for their on-going leadership in IPC and the electronics industry

Association Connecting Electronics Industries (IPC)

New IPC Initiative Focuses on E-mobility Quality & Reliability

Industry News | 2022-05-27 14:34:04.0

From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.

Association Connecting Electronics Industries (IPC)


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