Electronics Forum | Tue Nov 27 04:50:45 EST 2007 | lococost
you say you use the glue to keep the components on during wave, why would you want to solder them twice, once in reflow and once in wave?
Electronics Forum | Wed Nov 28 06:56:57 EST 2007 | shy
the paste is necessary for the component that had no glue. btw, for solder paste specs, 150C is at reflow time plus soaking time and i believe it will cause nothing to the glue and can cured as per recommended? correct me if i'm wrong.
Electronics Forum | Mon Nov 26 20:05:52 EST 2007 | shy
Hi Real Chunks, kindly help to elaborate more on the potential problem that i will face?
Electronics Forum | Thu Nov 29 10:39:42 EST 2007 | realchunks
Dave, Eject-eject-eject!
Electronics Forum | Thu Nov 29 13:02:33 EST 2007 | slthomas
Ahhh, our first casualty.
Electronics Forum | Sun Dec 02 16:42:53 EST 2007 | stepheniii
Does that work well with a "lights out" factory?
Electronics Forum | Mon Dec 03 15:09:13 EST 2007 | realchunks
Eject-Eject-Eject!
Electronics Forum | Mon Dec 03 16:30:30 EST 2007 | slthomas
It's OK, I could quit if I wanted to. *bites palm*
Electronics Forum | Fri Nov 30 08:53:17 EST 2007 | jaimebc
Shy, Our 5 and 6 mils stencils have home plate apertures and reduced by 10% and using SMT adhesive. Never had a problem with components non wetting like you have. I do believe that you are not screening enough paste, something about the dog bone ape
