Electronics Forum | Mon Jul 25 17:20:47 EDT 2005 | Dreamsniper
I'm confused. A paste Supplier suggested to turn off nitrogen during reflow because it is one source of voiding of bga solder joints...is this true? regards, Dreamy
Electronics Forum | Thu Aug 23 00:17:53 EDT 2001 | mugen
Mike, 1) NC process = less BGA voids & void-size 2) longer soak times... Heyz, thanks mate :) ~~~~~~~~~~~~~~ Dave F, tot u were inclinded to the school of thought, that NC process hath higher chance for whining abt voids?
Electronics Forum | Sat Oct 19 11:48:39 EDT 2002 | davef
Good points, John. Continuing to track on the voiding issue, why remove voids anyhow? * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on at least on a temporary bas
Electronics Forum | Mon Nov 16 03:31:22 EST 2009 | cunningham
I suggest you X-Ray the devices before you place them on the board we have just foun a large amount of voids on the BGA before its even placed
Electronics Forum | Mon Sep 30 09:00:26 EDT 2002 | arcandspark
Russ, I have been reworking BGA's for over five years now and have never been able to remove voids in the solder balls without removing the BGA itself. Your thermal profile can also cause the voids along with a poor solder paste. I have experimented
Electronics Forum | Mon Jan 22 21:30:41 EST 2001 | dason_c
I had my experience when I run the Motorola BGA and I am not sure the voiding was created due to the incompatible flux residue. Rgds. Dason.
Electronics Forum | Mon Nov 11 10:57:03 EST 2002 | davef
Search the fine SMTnet Archives for background on voiding in BGA
Electronics Forum | Sat Mar 06 02:54:25 EST 2004 | tommy
1)Solder paste selection 2)Reflow profile.Focus on soaking and TAL. 3)Moisture control for BGA. 4)Maybe the BGA solder ball already with void. 5)PCB design.Any via on bga land? 6)Solder masking type. 7)Solder paste volume apply on land. 8)IPC class 3
Electronics Forum | Mon Jan 22 22:37:27 EST 2001 | davef
50 ppm oxygen was on half joints reflowed in air. 3d Human factors PCB pad cleanliness: Handling of bare board pads creates excessive voiding. Print rejection: Cleaning of OSP pads with acetone or isopropanol increases voiding.
Electronics Forum | Mon Oct 21 09:09:54 EDT 2002 | Ben
thanks for ur help. i would also like to know the classes is for showing different level of requirement, or for different vertical location of void in joint. coz I heard from my workmate that the range from 9% to 36% is for void at different vertical
