The MX-3600 is an In-line X-RAY inspection system with the new MIPS-inspection platform of MatriX Transmission X-RAY technology is combined with the patented Slice-Filter Technology (SFT) for double-sided or overlaying applications. The high speed MX
The TR7700QM SII is built on a high accuracy platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI can inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart
The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The
Automatic high-speed in-line inspection system for electronic devices and assemblies. Featuring transmission x-ray technology, intelligent handling system for fast loading/unloading as well as MIPS software solutions for inspection of single-sided an
Features: World leading, Dual-sided Auto inspected at the same time. Best Pre & Post Wave AOI Inspection System providing the highest Return on Investment, (ROI) in the industry by eliminating the need for human inspection. Extra Large 10cm Dept
New Equipment | Rework & Repair Equipment
The Hakko FX-888D is an updated digital version of the popular FX-888 and includes several new features. User selectable preset temperatures and digital calibration simplify user setup and operation, and the new password protection and low temperatur
Features: Best Pre & Post Wave AOI Inspection System providing the highest Return on Investment, (ROI) in the industry by eliminating the need for human inspection. Extra Large 10cm Depth of Field eliminates the effects of component height. D
JUKI Bad Mark Sensor ASM E95547290A0 F70R JUKI Bad Mark Sensor ASM E95547290A0 F70R SMT Spare Parts JUKI Spare Parts Delivery time: 1-3 days Product description: JUKI Bad Mark Sensor ASM E95547290A0 F70R INQUIRY JUKI Bad Mark Sensor AS
New Equipment | Cable & Wire Harness Equipment
Compact, Stand-Alone Pulse-Heat Pulse Heat System The SMR features a Pulse Heat power output which provides controlled temperature ramp-up to reflow temperatures, reducing thermal shock risk and unwanted heating of adjacent solder joints. The syste
Mechatronika's M50 Pick and Place System is a versatile automatic machine for placing SMD components from 0402 to 35 x 35 mm. Matured, high quality rigid construction, ease to program and excellent price to performance ratio make M50 perfectly suit
