Industry News | 2017-06-07 12:04:53.0
PDR is pleased to introduce its new aluminum clad PCB rework tools for LED rework, flex circuit rework and aluminum clad circuit card assemblies. Designed to be incorporated into PDR’s existing line-up of Focused IR Rework Machines, PDR’s new Hot Plate series incorporates all of the best attributes of PDR technology into a contact heating system, thereby efficiently providing the thermal energy necessary to tackle the widest range of applications possible.
Industry News | 2021-01-05 10:40:44.0
Automotive Grade Aluminum Electrolytic Capacitors Increase Design Flexibility and Save Board Space in High Temp Applications
Industry News | 2021-11-22 08:15:05.0
Averatek is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Solder Paste for its new Mina™ chemistry. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during Productronica in Munich, Germany.
Industry News | 2009-10-16 20:47:17.0
Stylish aluminum carrying case opens to reveal a 10,000 cph counter of surface mount devices that is easily carried, ideal for off-premises inventory taking and incoming/outgoing parts count verification.
Industry News | 2015-01-13 11:24:14.0
Vancouver, BC, January 13, 2015—Omni Circuit Boards Ltd. announced today the signing of a research and development agreement with D-Wave Systems Inc., the first commercial quantum computing company, in support of the further advancement of aluminum trace printed circuit boards (Al-PCB) for quantum computing applications.
Industry News | 2020-12-29 19:43:12.0
United Chemi-Con Flat Chip Aluminum Polymer Capacitors Provide 5,000 Hours of Operation at 105°C Guaranteed
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2012-02-22 01:47:58.0
Nihon Superior will introduce several new developments in soldering processes and materials in Booth #3044 at the upcoming IPC APEX Expo.
Industry News | 2021-08-27 11:46:08.0
New Yorker Electronics Releases the Barker Microfarads +105°C Tubular Axial Lead Aluminum Capacitors, a Mil-Spec Equivalent designed for Commercial Use
Industry News | 2019-02-09 20:43:45.0
Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz.
