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• Skips in the printed solder due to blocked stencil aperture • Misaligned solder print • Improper stencil thickness • Inadequate stencil aperture size
| http://etasmt.com/te_news_bulletin/2021-08-31/23570.chtml
• Skips in the printed solder due to blocked stencil aperture • Misaligned solder print • Improper stencil thickness • Inadequate stencil aperture size
| http://etasmt.com:9060/te_news_industry/2021-09-15/26565.chtml
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic3159&OB=DESC.html
Posted: 29 Aug 2022 at 10:37pm The Paste Mask Aperture openings are laser cut. Even though the shape in the CAD library is rectangle, the stencil mfr
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from the solder before it solidifies. Process and design-related causes: • Improper solder volume due to improper land design • Improper solder volume due to blocked stencil aperture
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. Process and design-related causes: • Excessive volume of solder due to improper pad dimension • Excessive volume of solder due to improper stencil aperture
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2306&OB=ASC.html
://www.ti.com/lit/ds/symlink/tlv713p.pdf ; But less solder can also be achieved by thinning the paste mask stencil where small aperture openings are
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/rounded-rectangle-pad-shape-for-son-qfn_topic617_post2357.html
(except Grid Array) then that should improve fabrication, stencil paste application, assembly reflow and inspection. I believe Rounded Rectangle pad shape is the future for several reasons, but the top is "all stencil apertures are created using laser technology and that produces a corner radius on the SMT aperture openings
