Electronics Forum | Thu May 30 08:04:25 EDT 2002 | zanolli
Hello Russ, I'm not quite sure I understand your question. Are you saying that you must hand solder these connectors because the gold plating doesn't allow other though hole processing methods to wet the solder the length of the pin in the PTH? Reg
Electronics Forum | Thu Jun 13 11:27:25 EDT 2002 | davef
>*Changing paste >EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current application naturally is stencil printing.
Electronics Forum | Wed Jun 26 17:52:36 EDT 2002 | davef
Search the fine SMTnet Archive for: The Effect Of Metallic Impurities On The Wetting Properties Of Solder by: Dennis Bernier Vice President, Research & Development Kester Solder Company [ http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread
Electronics Forum | Thu Aug 01 07:06:28 EDT 2002 | gdstanton
Just exploring options to improve wetting. It turns out our facilities dept is looking at an N2 generator to supply dry boxes. Thought it might be a good idea to assess whether we should expand the project to include reflow.
Electronics Forum | Mon Aug 05 11:08:22 EDT 2002 | Claude_Couture
You must try cleaning the heads with a wet head cleaner. Dry tape cleaner just scratches your heads. Demagnetizer is good to use after a good cleaning.
Electronics Forum | Wed Sep 18 20:55:33 EDT 2002 | scottefiske
I'm with you dave...please provide specifics as to defect condition... Are you getting good wetting to both land and lead? Is there any repeatability to lead/location/device? Do you have paste inspection capabilites to verify deposition? Is it a Pala
Electronics Forum | Mon Sep 23 22:31:48 EDT 2002 | davef
Comments are: * It�s interesting, but not surprising that your time above liquidous varies around the sides of this component. * You are correct in thinking that it is better to reduce than to increase the temperature differences around the component
Electronics Forum | Sat Sep 28 05:30:44 EDT 2002 | ivanchu
Stencil cleaning process is taking by machine every 15 boards. We are using wet, vaccune, Dry, Dry cleaning process. The aperture of the stencil is fullfil the aspect ratio.
Electronics Forum | Mon Nov 25 09:34:52 EST 2002 | davef
You're correct excessive temperature can cause dewetting, but that usually means realeeee hot. Excessive time at above liquidous will cause dewetting also.
Electronics Forum | Tue Dec 10 22:18:32 EST 2002 | davef
Randy's correct. If you were soldering to nickel with WS609, you would be complaining about non-wetting, not lumpy solder flow.
