Electronics Forum | Thu Aug 03 11:32:44 EDT 2000 | bzark
Any opinion on what size aperture and stencil thickness is most optimum for Land Grid Array 1.27mm pitch with .6mm pad using SN/AG NC solder paste?
Electronics Forum | Mon Aug 14 13:51:37 EDT 2023 | calebcsmt
I'm actually currently in the process of discussing with stencil MFG regarding the apertures and reduction to see if perhaps it was not optimal for this fine pitch QFN, as just as you mentioned, we have similar products with similar QFNs that do not
Electronics Forum | Wed Oct 11 16:24:35 EDT 2000 | John Thorup
Hello Antonio ASPECT RATIO = the ratio of one dimension to another as in the ratio of the thickness of a stencil to the width of the aperture. For instance, a 10 mil aperture in a 5 mil stencil will have an aspect ratio of 2. This is aperture width
Electronics Forum | Fri Jan 17 15:36:23 EST 2003 | davef
How do 0.5 mm pads on the board help paste release from the stencil? Paste release from the stencil is a function of: * Paste * Printer operation * Stencil design You have no obligation to made your stencil apertures the same size as the pads on yo
Electronics Forum | Fri Jul 06 04:55:59 EDT 2012 | ccgooi
I have fabricated a artwork of stencil on a mylar and make comparison on PCB and Stencil in order to confirm if there is any PCB stretching at both end. The results are comparable for both stencil and PCB without any stretching . So,I assumed that th
Electronics Forum | Mon Dec 20 12:50:27 EST 1999 | Wolfgang Busko
Hi Pascal, 0,65mm pitch normally isn�t much of a problem. With 90�m CU I don�t have any experience but would like to know what deviation from nominal value for the pads you get with different PCB-deliveries. In short, for the standard Cu=35�m we se
Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno
Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o
Electronics Forum | Thu Dec 14 22:28:38 EST 2006 | Tony
Hi, where can I find info about how to make the pad design to work for VSSOP48 0.4 mm Pitch & TSSOP56 0.5 mm pitch components? I should also mention that we are working in a project that this 14 layers High-Frequency RoHS board is included. The pad c
Electronics Forum | Sat Nov 10 21:15:04 EST 2007 | mika
make 4 square rounded corner apertures around the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. We SMT-mount & reflow soldering various QFN packages onto our customers pcb:s wi
Electronics Forum | Sat May 30 01:31:49 EDT 2009 | mika
make 4 square rounded corner apertures on the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. Don't worry to much of the void's. Just following my tips and you will be fine. The
