Electronics Forum | Fri Oct 12 16:01:23 EDT 2018 | davef
Feature||Class 1||Class 2||Class 3 Circular wetting of solder of the lead and plated hole barrel on the component side.||Not Specified||180 deg||270 deg Plated hole fill.||Not Specified||75%||75% Circular fillet and wetting of solder of the lead a
Electronics Forum | Tue Jan 29 08:21:50 EST 2019 | electronics101
Hi All, Can someone please help, I have a number of tall surface mount components that according to IPC 610 (8.2.2.3) are a fail due to the end termination not wetting at least 0.5mm + solder height. The components are very well soldered but the sol
Electronics Forum | Wed Jan 30 02:50:33 EST 2019 | electronics101
Hi Steve Thanks for coming back to me, you are correct IPC class 3 is required. We are getting great wetting onto the device but not as per IPC 3 with the wetting rising about 0.25mm. I am questioning whether it is actually possible with such a (re
Electronics Forum | Mon Nov 13 11:31:10 EST 2000 | John Rep
I am having a problem with wetting on some feedthru wires. The problem seems to be contamination on the wires, due to the fact that the problem seems to be wire lot dependent. I have analysed it using SEM and come up with very little. Is there ano
Electronics Forum | Thu May 04 17:14:11 EDT 2000 | Boca
Solder 'follows' heat, sounds like the fab is heating up faster than the component. Or the components are solderability 'chanllenged' and the paste turns liquid, and would rather spead out on the land than wet to the component termination. Are thes
Electronics Forum | Fri Mar 16 13:33:21 EST 2001 | gdstanton
Anyone out there have a real good stencil printing process control document for an MPM Corporation stencil printer model # SPM? We are seeing lots of bridging, wetting, and filling problems. Thanks in advance for your help.
Electronics Forum | Wed Aug 23 09:05:38 EDT 2000 | Dave F
Dr. Lee: In using environmental screening tests to assess solder joint reliability, what are the effects that make low temperature vibration effective in screening of poorly wetted solder connections? What temperature and vibration profile are effe
Electronics Forum | Thu Aug 24 13:25:01 EDT 2000 | Dave F
What factors in the manufacturers' description of a paste properties give clues to the wetting rate and boiling point of solvents of fluxes?
Electronics Forum | Thu Aug 24 13:36:07 EDT 2000 | Dr. Ning-Cheng Lee
Regarding the boiling point, MSDS may have some infomation reflecting that. Other description such as long stencil life and long tack time may also reflect. Wetting rate typically is not stated in product data sheet. You will need to determine it y
Electronics Forum | Wed May 02 13:59:20 EDT 2001 | kt
Can anyone tell me what they think is the main cause of excessive solder at the end of the lead after wave. These are not solder peaks as if the leads were cold. It is a well wetted ball of solder on end of the lead. Also, some times you see excessiv
