Electronics Forum | Thu Sep 18 23:56:56 EDT 2008 | trynders
am having wetting issues with two Burr Brown Op amps. Both are SOICs with NiPdAu lead frame finishes. I have attached a photo that shows a black streak the length of the lead (before soldering). This appearance is consistent of all leads and is exist
Electronics Forum | Mon Aug 03 15:04:03 EDT 2009 | davef
We know nothing about your: * Solder alloy * Materials of your board * Materials of your teminal block * Process setup of your wave * Wetting condition of the board or the terminal block ... but we'll take a guess anyhow. Tin-copper based solder all
Electronics Forum | Thu Sep 03 04:53:31 EDT 2009 | d0min0
to summarize - 3 components are placed on a single module x 8 on pcb - 2 anodes & 1 cathode are infected (so no component for us) - the problem does not look like wetting problem as the component and land pad is wetted, but the paste is not complete
Electronics Forum | Fri Feb 15 14:38:59 EST 2013 | bmario
Hi, We are having a problem with the interpretation of the surface evaluation criteria of J-STD-003 section 4.2.2.4.2. "A minimum of 95% of each of the surfaces (i.e. each pad) being tested shall exhibit good wetting. The balance of the surface may
Electronics Forum | Tue Mar 25 13:55:05 EDT 2014 | horchak
Ok lets put it this way. If the PCB house used a high quality mask and properly applied it to a properly cleaned surface and properly cured it, then as Dave stated above there are only two things that can destroy it. Excessive heat and overly aggress
Electronics Forum | Thu Apr 17 13:37:11 EDT 2014 | anvil1021
Hello All....we have several hundred PCBs that we need to run with a no-clean solder process and the surface finish is OSP. Our preliminary testing has found that the solder will not wet the entire pad even if the pad is over printed? We have contact
Electronics Forum | Fri May 30 20:03:14 EDT 2014 | hegemon
Starting with the manufacturers layout is a good start. Tilted parts, bad solder joints, sounds like a wetting issue and the board or the parts. Insufficient solder sounds like the printing process needs some attention. We have used this part in th
Electronics Forum | Thu Aug 10 11:24:18 EDT 2017 | dleeper
The exposed metallization on the sides of the QFN probably aren't tinned and therefore not expected to have solder wetted to them. If previous parts formed nice toe filets, it might just be that those parts were fresher and the exposed metal did not
Electronics Forum | Fri Oct 12 16:01:23 EDT 2018 | davef
Feature||Class 1||Class 2||Class 3 Circular wetting of solder of the lead and plated hole barrel on the component side.||Not Specified||180 deg||270 deg Plated hole fill.||Not Specified||75%||75% Circular fillet and wetting of solder of the lead a
Electronics Forum | Tue Jan 29 08:21:50 EST 2019 | electronics101
Hi All, Can someone please help, I have a number of tall surface mount components that according to IPC 610 (8.2.2.3) are a fail due to the end termination not wetting at least 0.5mm + solder height. The components are very well soldered but the sol
