Electronics Forum | Tue Jun 02 15:01:57 EDT 2015 | tombstonesmt
What is the reduction in aperture size for your stencil versus pad? Or are they at 100%?
Electronics Forum | Fri Nov 05 03:53:29 EDT 2010 | Mark
The smallest particle sixe for type 3 paste in 25 microns. This is far to big to remain airborne.Therefore I would suggest to continue to use air to clean stencils as it does clean the apertures effectively.What solvent is used to clean the stencils?
Electronics Forum | Wed Nov 10 18:02:54 EST 1999 | John Thorup
Hi Dave Sounds like what we call a "squeeze ball". Usually caused by excess paste squeezed over the mask between the pads of the component when placed. This sometimes escapes the pull of surface tension back to the fillet and escapes to the side, us
Electronics Forum | Thu Jun 26 21:38:31 EDT 2003 | Dreamsniper
Hi Guys, Need your good advice about this for a 5 thou stencil thickness: 0603 pad is 50mil x 40mil 0805 pad is 75mil x 45mil 1206 pad is 70mil x 50mil I want the above apertures to be in IPC STD Homeplate Design + an area reduction of 15%. Will t
Electronics Forum | Thu Jan 22 20:10:19 EST 1998 | Raymond
I have the following questions with regards to the solder printing stencil design : 1) Is the Electro-polish process recommended for laser cut stencil ? 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal openin
Electronics Forum | Tue Jun 27 10:51:42 EDT 2000 | Ioan
Hi Bill, there are a couple of things you should check. Most likely you have too much paste which is squashed at the insertion of the cap. - the paste height, around 7 mils should do. Too much paste will cause shorts under the cap at insertion which
Electronics Forum | Fri Oct 18 07:14:51 EDT 2002 | cyber_wolf
Have you tried using a paste with a more aggressive flux? Our main paste is Indium, but whenever we run into oxidized parts or have soldering problems due to oxidation on pads we use an older Alpha WS paste called WS609. The drawback of this paste is
Electronics Forum | Wed Feb 05 21:05:38 EST 2003 | davef
Iman On your situation: As an earlier poster stated, your options are limited to opening you stencil aperture to compensate for the paste lost to the via. On your designer's belief that "it helps in heat dissipation": Could be true, but: * Hole wil
Electronics Forum | Tue Aug 31 02:15:12 EDT 2004 | AOI Solution
I need to address the issue for colorful display on solder joints, for whoever researched on this machine, no one can deny it is a smart feature for visual assistance. however, it is still Mono color "gray scale" algorithm. it basically "paint" the i
Electronics Forum | Fri Sep 10 17:32:59 EDT 2004 | Yngwie
We have recently faced lifted lead problem that happened on our 20 mil pitch QFP. We have infact pushed it back to the incoming quality, but still I have a few questions to bring up : 1) what is the typical coplanarity tolerance that ICs' manufactur
