Industry News | 2023-04-03 13:24:06.0
IPC welcomes the action of U.S. President Joe Biden today in issuing a "presidential determination" that prioritizes the domestic development of printed circuit boards (PCBs) and advanced packaging, including IC substrates, under Title III of the Defense Production Act (DPA).
Industry News | 2008-01-31 14:26:48.0
ORLANDO, FL - The SMTA and Auburn University are pleased to announce that the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Workshop will be held August 18-19, 2008. The 2008 program will move from Indianapolis to Orlando to co-locate with SMTA International.
Industry News | 2008-12-19 18:59:58.0
Minneapolis, MN � The SMTA and Auburn University are pleased to announce that the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Symposium will be held October 5-6, 2009. Dr. John Evans, Conference Chairman and the program technical committee invite you to submit an abstract to participate in this exciting program. The symposium will once again focus on harsh environments with an emphasis on military and space.
Industry News | 2010-02-08 12:28:51.0
Minneapolis, MN - The SMTA and Auburn University are pleased to announce that the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Symposium will be held October 25-26, 2010. Dr. John Evans, Conference Chairman and the program technical committee invite you to submit an abstract to participate in this exciting program. The symposium will once again focus on harsh environments with an emphasis on military and space.
Industry News | 2013-08-20 23:02:16.0
Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Industry News | 2012-11-27 15:24:14.0
IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.
Industry News | 2021-11-24 15:25:19.0
Stronger IC substrate and OSAT capabilities are needed to realize U.S. semiconductor goals
Industry News | 2008-03-03 22:50:34.0
BANNOCKBURN, Ill., USA, February 26, 2008 � Technological advances on the horizon and future industry demands � this is the focus of �Will You Be Ready?: An Endicott Technology Interchange,� sponsored by IPC � Association Connecting Electronics industries�.
