Partner Websites: substrate (Page 4 of 141)

Stud pull

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/stud-pull

components to the substrate.  This is a complimentary technique to the more common die shear test, with both methods being used to get a full understanding of the die-substrate bond strength

ASYMTEK Products | Nordson Electronics Solutions

How many PCB classifications are there? From material talk-SMT Technical-Reflow oven,SMT Reflow Sold

| http://etasmt.com/te_news_industry/2021-10-14/26961.chtml

.   And our epoxy resin and BT are all organic materials.   2. Inorganic materials:   ① Aluminum substrate: The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function

How many PCB classifications are there? From material talk-SMT Technical-Reflow oven,SMT Reflow Sold

| http://etasmt.com:9060/te_news_industry/2021-10-14/26961.chtml

.   And our epoxy resin and BT are all organic materials.   2. Inorganic materials:   ① Aluminum substrate: The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function

PCB Libraries Forum : FR4

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_fr4_topic2234.xml

PCB Libraries Forum : FR4 PCB Libraries Forum : FR4 This is an XML content feed of; PCB Libraries Forum : PCB Design Basics : FR4 FR4 : The base material, or substrate

PCB Libraries, Inc.

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf

. We will explore direct warpage mitigation as well as independent substrate/wafer clamping systems as well as inline and recirculating automation solutions

Heller Industries Inc.

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf

. We will explore direct warpage mitigation as well as independent substrate/wafer clamping systems as well as inline and recirculating automation solutions

Heller Industries Inc.

MPM BTB 125 Printing Machine MPM / Speedline Solder Paste Printing

KingFei SMT Tech | https://www.smtspare-parts.com/sale-40602034-40146452-juki-3020-t-axis-motor-hc-bp0136d-s8-original-new-10w-motor.html

:1039KG Power requirements:200~400VAC/60Hz,15A Air source requirements:5KGf/cm2(0.5Mpa) Parameter Substrate size:609.6mmx508mm Minimum substrate size

KingFei SMT Tech

Quantum Q-6800 High-Value Fluid Dispensing System | Nordson ASYMTEK

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/fluid-dispensing-systems/quantum-q-6800-high-value-fluid-dispensing-system

calibration enables quick and repeatable set-up Standard features including range-finding laser height sensor , digital vision system, and substrate heating capability Large 423 x 458 mm dispense area

ASYMTEK Products | Nordson Electronics Solutions

VOIDS IN SOLDER

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1066-voids-in-solder

. The image was generated at 50 MHz by focusing through the copper base to the copper base/ceramic substrate interface. Result The black areas observed in the substrate regions (multi-colored areas

ASYMTEK Products | Nordson Electronics Solutions


substrate searches for Companies, Equipment, Machines, Suppliers & Information

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