Electronics Forum | Tue May 06 21:24:28 EDT 2014 | davef
Most ceramic you'll see comes from Coors or Kyocera. Size of your substrate will vary according to the stencil / component that you're using. 3" by 3" should be sufficient for most applications. If you get them too small, you could have handling is
Electronics Forum | Fri Jan 27 17:36:40 EST 2017 | davef
Consider that printing may not be the only approach to getting paste on to your board. Would a dispenser work better?
Electronics Forum | Mon Jan 30 19:20:45 EST 2017 | jgo
Thanks Rob. I'm not so sure in a mass production environment that using the mount spray and kapton tapes are going to be efficient. For solder paste dispensing, any idea what is the smallest solder dot size the machine can dispense?
Electronics Forum | Mon Jan 30 19:22:28 EST 2017 | jgo
I just assume when you have laminates that thin, it will invariably be warped in some degree. I have worked on a few and I have never seen one that is not warped consistently.
Electronics Forum | Mon Jan 30 19:38:13 EST 2017 | jgo
Looks like a similar product to magic resin. Thanks I'll check it out.
Electronics Forum | Tue Jan 31 19:32:18 EST 2017 | jgo
Hi Rob, So do you have to constantly remove the old adhesive and spray on new ones? Is that an automated process? Also for the kapton tape removal and application, is that automated as well?
Electronics Forum | Tue Jan 31 21:15:52 EST 2017 | davef
Dispensing: You can dispense for 0201 and above Warped laminates: Ask your laminate fabricator what's ausing the warping and how to make it go away
Electronics Forum | Tue Jan 31 08:59:24 EST 2017 | rob
Hi Joshua, We ran 150K per week this way, you just need a lot of pallets. Regarding dispensing I've seen 0201 (Imperial)paste dispensed, so about 0.4ish mm dots. I'm sure the Mydata printer is also pretty high resolution too, but not too quick.
Electronics Forum | Wed Feb 01 02:11:38 EST 2017 | Rob
Hi Joshua, No, the adhesive lasts 2 or 3 runs. The adhesive is put on manually as is the kapton. It's a big panel for a flex - nearly 300 x 210, so the operator loading the boards onto the pallet and fixing them (then into a buffer) stays well ahe
Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.
Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i
