Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
Quick Overview Lead Free Best Solution Independent control box equipped with preheat funciton based on ADS-3530 enrich the machine's funciton and make the machine more practical. Auto Dip Soldering Machine ADS-3530G Features ● Pin
New Equipment | Rework & Repair Services
Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb
New Equipment | Solder Materials
WS735 is an alcohol based, organically activated, water-soluble liquid flux designed specifically for wave solder applications. WS735 may be applied by automated flux sprayers, foamed, dipped, or brushed on with favorable results. WS735 is active at
New Equipment | Solder Materials
Cored Solder Wire is specially designed with low residue, chlorine content less than 0.1%, flux content 2.0%+0.5 for Hand/Automatic soldering applications assembly. Soldering Wire is available in many alloy composition, Sn60 and Sn63 are the most re
Industry News | 2014-08-25 21:13:55.0
The Balver Zinn Group announces that Han Raetsen, Area Sales & Support Manager, will present at the IPC Standard and Electronic Manufacturing workshop and seminar. Raetsen will present, "Mixed Technology: The impact of using a SnPb soldering material in combination with Pb-free components", and "Reliability of Fluxes in Selective Soldering Applications."
Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Used SMT Equipment | Soldering Equipment/Fluxes
Solder Wave by SEHO, in good condition. SEHO GoWave 1030 product information. Usable soldering width max. 340 mm [13.39”] Pass-through height (measured from bottom edge of PCB) 100 mm [3.94”] PCB / solder mask dimensions l x w max. 410 x 340 m
Used SMT Equipment | Soldering Equipment/Fluxes
Solder Wave by SEHO, in good condition. SEHO GoWave 1030 product information. Usable soldering width max. 340 mm [13.39”] Pass-through height (measured from bottom edge of PCB) 100 mm [3.94”] PCB / solder mask dimensions l x w max. 410 x 340 m
