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Express Newsletter: signal integrity (Page 4 of 35)

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

SMTnet Express April 25 - 2013, Subscribers: 26322

SMTnet Express - September 23, 2021

ERP or Best of Breed Software

A HDMI design guide for successful high-speed PCB design

Economical aluminum substrates make light work of visible LED circuits

SMT Express, Volume 3, Issue No. 4 - from SMTnet.com

SMTnet Express - April 30, 2015

SMTnet Express, April 30, 2015, Subscribers: 22,686, Members: Companies: 14,334 , Users: 38,119 Signal Transmission Loss due to Copper Surface Roughness in High-Frequency Region Elaine Liew; Mitsui Copper Foil Malaysia, Shah Alam Malaysia, Taka

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