New Equipment | Solder Materials
KappTecZ is a high temperature, high strength solder that may be used on most metals, but works extremely well on aluminum, copper and stainless steel. It has a high tolerance to vibration and stress, and good elongation for use on dissimilar metals.
Industry News | 2012-07-25 15:16:14.0
The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
Hand push pcb cutting machine depaneling 330mm length pcba YSV-2M Specification for pcbcuting machine : 1.Easy operating modes 2.Easy setting, edge guiding 3.Cutters re-grinded 4.Avoid micro-cracks v-cut PCB depaneling
Industry News | 2011-01-26 20:33:39.0
Christopher Associates announced today the introduction of Koki’s S01X7C48-M500 High-Reliability Low-Ag Lead-Free Solder Paste. In response to the rise in the cost of metal, particularly silver, Koki has developed a lower cost alternative.
pcb separator - YSVC 1 http://www.pcbpunchingmachine.com Email?sales@yushunli.com evaliu@yushunli.com http://www.vcutpcbdepaneling.com Website?http://www.hk-yush.com /http://www.pcbdepanelingmachine.com http://www.vcutpcbdepaneling.com / http://www.y
Industry News | 2014-08-28 15:48:58.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, Director of Applications, will present two papers at the upcoming SMTA International exhibition.
Industry News | 2023-01-23 18:38:38.0
Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.
Industry News | 2023-01-30 16:56:37.0
For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place February 1-3, 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.
Industry News | 2016-04-21 00:17:09.0
SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.
