Industry News | 2013-05-07 13:45:19.0
AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.
Industry News | 2013-11-01 13:11:17.0
Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.
Industry News | 2014-04-03 13:47:58.0
Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China.
Industry News | 2013-11-14 18:14:55.0
Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Industry News | 2023-09-11 17:19:08.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its SN100CV P608 solder paste in Booth #1415 at the SMTA International Exposition, scheduled to take place Oct. 10-11, 2023 at the Minneapolis Convention Center in Minneapolis, MN.
Industry News | 2024-03-18 12:19:32.0
Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to innovation, Nihon Superior will present a range of groundbreaking products, including the SN100CV® P608 solder paste and the TempSave™ series of low-temperature soldering materials.
Industry News | 2008-03-09 00:07:32.0
OSAKA, JAPAN � March 6, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper with DfR Solutions, titled �Accelerated Reliability Testing of Ni-Modified SnCu and SAC305,� to the Technical Conference that is part of the IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics scheduled to take place March 11, 2008 at the Sheraton Raleigh Hotel in Raleigh, North Carolina.
Industry News | 2010-11-02 10:42:48.0
Christopher Associates today announced the US introduction of Koki’s S3X48-M500 and S3X48-M500C Printable No-Clean Lead-Free Solder Pastes. Originally designed and formulated for superior head-in-pillow performance, the pastes also exhibit exceptional wetting and printing.
Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
Industry News | 2011-08-18 12:44:10.0
Nihon Superior introduces SN100C (551CT), the newest addition to its SN100C lead-free solder series.
