Electronics Forum | Thu Sep 04 02:43:09 EDT 2008 | benefon
Thanks This error only occurred with one oven profile with the reflow zone temperature set at 270�C. Perhaps it really has to do with the exhaust pull as the oven is operating very near its temperature limit with this profile. I will check that. Tha
Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper
we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i
Electronics Forum | Tue Sep 11 12:45:01 EDT 2007 | rgduval
Both questions will depend upon the IC specifications. Check the manufacturers recommendations for temperature specification, as well as reflow profiling. As a general rule, we don't like to rework a component more than 2 times after initial reflow
Electronics Forum | Tue Sep 11 11:40:17 EDT 2007 | shing
Please help to answer me the followings questions: 1. The optimum temperature for IC reapir (TSOP & BGA), since many IC found defective after reapir by hot air gun 2. How many time does a IC(TSOP & BGA) can pass throught the IR Reflow without defecti
Electronics Forum | Mon Jan 26 15:09:59 EST 2009 | leemeyer
IPC 7530 - Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
Electronics Forum | Mon Jan 26 11:58:06 EST 2009 | ghcarnu
Hi there, where can I find some hints about placing the temperature sensors on the pcb when determining the reflow profile? I'm interested especially in the case of a pcb having BGA's. Thanks for your answers ! gheorghe
Electronics Forum | Tue Feb 03 14:19:29 EST 2009 | grics
I would agree if you have a board to setup the process. But sometimes this doesn't work... If for some reason if the customers AVL has a Lead Free BGA and I am running Leaded paste (yes this really happens!), you will need to run hotter to get your
Electronics Forum | Mon Jul 12 07:47:41 EDT 2010 | rgduval
Talk to your paste manufacturer, they can recommend a reflow profile (as well as advise the paste activation temperature, and liquidous reflow points. The ENIG finish should not affect your reflow parameters any more than the solder paste. Typicall
Electronics Forum | Fri Sep 21 11:02:37 EDT 2001 | davef
You can measure temperatures any place that you would like, but the issue is the temperature of the solder. We've seen solder temperatures that vary from lead to lead on the same component. Why don't you want to measure the temperature of your so
Electronics Forum | Mon Jul 12 05:54:34 EDT 2010 | xps
Hi everyone, someone knows the correct parameters for reflow the smt devices using SnPb on ENIG finishing ? Someone suggest to use more temperature than others finishing, cause nickel barrier. Someone can confirm this ? There are handbooks or articl
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