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MIRTEC Wins 2023 Mexico Technology Award for Its GENESYS-CC AI-Based Conformal Coating AOI Series

Industry News | 2023-10-30 18:40:38.0

MIRTEC today announced that it is the recipient of the 2023 Mexico Technology Award in the Conformal Coating Inspection category for its revolutionary GENESYS-CC AI Based Conformal Coating AOI Series. The award was announced during a ceremony held on Wednesday, October 25, 2023 during the SMTA Guadalajara event in Mexico.

MIRTEC Corp

Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

SMTnet

Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

SMTnet

parvus Corp. Now Shipping its Biothenticator� PC/104 Biometric Fingerprint Sensor Module for Embedded System User Authentication

Industry News | 2003-03-27 08:15:33.0

Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics

SMTnet

Virtex-II FPGA Prototyping Boards Enable Complex FPGA Design Evaluation & Testing

Industry News | 2003-06-16 09:12:35.0

Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces

SMTnet

Receptacle Makes Room for Drive Mounting

Industry News | 2003-02-26 08:37:36.0

An extended-height press-fit compliant pin SCA-2 receptacle is the latest addition to the SCA-2 product family.

SMTnet

New Reference Guide from Schaffner Provides Comprehensive RF Immunity Test Information for Engineers

Industry News | 2003-03-10 08:41:03.0

provides an overview of the main features of both conduction coupling and radiated field coupling, the two primary RF immunity test methods.

SMTnet

Noncontact Switching Comes to Confined Spaces

Industry News | 2003-03-26 08:25:40.0

The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Wire-to-board Range Handles Up To 16A

Industry News | 2003-05-12 09:19:51.0

No larger than conventional 12A wire-to-board connectors for PCB applications

SMTnet


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