Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Industry News | 2014-07-24 21:00:30.0
IPC Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2014 is now available. The annual study provides data to electronics assembly companies interested in comparing their key 2013 quality metrics to those of other assembly companies by company size, region and type of product.
Industry News | 2015-09-02 12:17:28.0
IPC Study of Quality Benchmarks for Electronics Assembly 2015 is now available from IPC. The annual study provides data to electronics assembly companies interested in comparing their quality measurements to those of other assembly companies by company size, region and type of product.
Industry News | 2016-08-31 18:41:55.0
IPC's Study of Quality Benchmarks for Electronics Assembly 2016 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.
Industry News | 2014-06-04 10:47:51.0
The Surface Mount Technology Association (SMTA) announced the recent release of their first online training course, Stencil Printing and Troubleshooting 101.
Industry News | 2020-04-14 19:07:23.0
ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.
Industry News | 2012-08-08 17:44:58.0
IPC Recently released, IPC-7527 was the brainchild of Task Group Nordic (TGNordic), IPC’s volunteer standards development group in Scandinavia.
Industry News | 2023-11-27 12:45:07.0
The Surface Mount Technology Association (SMTA) announces the release of several more webinars, photo libraries, and poster sets as part of a generous donation from renowned industry expert, Bob Willis.
Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
Industry News | 2014-09-06 17:51:35.0
IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.
