Industry News | 2015-07-21 08:01:30.0
KYZEN’s will exhibit in booth #A-1P01 at NEPCON South China 2015, scheduled to take place August 25-27, 2015 at the Shenzhen Convention & Exhibition Center. KYZEN’s team will display the globally acclaimed, advanced technology AQUANOX® A4708, which already has won three industry awards since its debut earlier this year.
Industry News | 2015-11-01 18:53:43.0
KYZEN announces that it will exhibit at the SMTA LA/Orange County Expo & Tech Forum, scheduled to take place Thursday, Nov. 5, 2015 at The Grand Event Center. The KYZEN team will be available to answer cleaning questions, and will have the AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry on display.
Industry News | 2010-03-30 15:48:49.0
MADISON, AL - STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Casey H. Cooper, Electrical Engineering Manager will present a paper titled "Embedded Packaging Technologies: Imbedding Components to Meet Form, Fit, and Function" at the upcoming IPC/APEX conference and exhibition.
Industry News | 2009-04-08 15:51:43.0
MADISON, AL � April 2009 � STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Mark McMeen, V.P. of Engineering Services, will give a presentation titled, �Embedded Component Die Technology� at SMTA Huntsville, scheduled to take place on Tuesday, April 14, 2009 from 12:45-1:15 p.m.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2009-09-17 14:35:25.0
MADISON, AL — September 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Jim D. Raby, P.E., Mark McMeen, V.P. of Engineering Services, and Casey H. Cooper, Electrical Engineering Manager will give a presentation titled “Imbedded Die Assembly Process, Is It Ready Yet?” at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session ET3 titled, “System in Packaging (SiP), which is scheduled to take place Monday, October 5, 2009 from 1-2:30 p.m. in the California room.
Industry News | 2019-09-25 16:15:46.0
Practical Components announces that it will exhibit in booth 31 at the 2019 International Wafer-Level Packaging Conference (IWLPC) from October 22-23, 2019 at DoubleTree by Hilton in San Jose, CA. Practical Components has added many new Test Wafers for miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.
Industry News | 2013-11-06 09:41:35.0
Indium Corporation's Sze Pei Lim, Technical Manager - Asia-Pacific Operations, will present at the SMTA Penang Expo and Tech Forum, November 8 in Penang, Malaysia.
Industry News | 2019-10-17 15:26:25.0
Practical Components announces that it will showcase its advanced technologies in representative AAT Aston’s exhibit at Hall A2 Stand 578 scheduled to take place November November 12-15, 2019 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2018-10-02 17:16:16.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming iMAPS 2018 – Pasadena 51st International Symposium on Microelectronics exhibition and conference, scheduled to take place October 9-11, 2018 at the Pasadena Convention Center in California.
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