Electronics Forum | Thu Jan 13 09:55:42 EST 2005 | WDLau
Hi Dave, Then you think it is ok to use leaded (Sn/Pb) BGA with Lead free solder paste (SAC)and reflow process, As someone told it is not reliable and it should not be allowed to go,
Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken
profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r
Electronics Forum | Fri Oct 31 11:37:35 EST 2003 | caldon
Hi John- Try http://www.Aimsolder.com There website has some articles regarding this. Also, try http://www.smtinfocus.com one of the best compiled resources I have come across. Cal
Electronics Forum | Fri Oct 31 13:06:42 EST 2003 | Kris
Hi, What would also be important is the time above 217. 20 secs above 225 may be the same as 45 secs above 218 That 7 degres might just buy you enough to sweep the non lead free components through Has anyone tried 220 or 218 peak temp but at lo
Electronics Forum | Thu Jul 20 12:22:57 EDT 2000 | newf
How are Component manufactuers addressing the PB free solder inititive? Since I am told higher processing Temps will be required to reflow the pb-free alloy.
Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz
Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried
Electronics Forum | Sun Dec 26 21:18:04 EST 2004 | tellinghuisen
Chris, We also do not allow the use of Lead-Free BGAs in a lead based process. It is actually one of the things that scares us most about converting to Pb-free. Most of the suppliers that we have talked with are planning on moving to the SAC
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Thu Jan 29 06:29:33 EST 2009 | sachu_70
There are two profiles available for the Pb-free process: (1) RSS and (2) RTS. In your case, you should try a solder paste that supports RTS profiles. A minimum of 7 zone Refow Oven would be fine on the Pb-free process. However, you may still try by
