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Best Technical Paper at IPC APEX EXPO 2019 Selected

Industry News | 2018-12-18 20:24:14.0

The best technical conference paper of IPC APEX EXPO® 2019 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, January 29, 2019.

Association Connecting Electronics Industries (IPC)

SMTA China Presents Awards at SMTA China East 2011

Industry News | 2011-05-16 16:53:28.0

SMTA China announces that it presented eight overall awards, nine best paper/presentation awards and two best exhibit awards at the SMTA China East 2011 Conference Award Presentation Ceremony, held on Thursday, May 12, 2011 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala dinner.

Surface Mount Technology Association (SMTA)

Douglas Pauls Elected to Chair IPC's Top Standards Development Leadership Committee

Industry News | 2012-03-07 19:35:54.0

IPC announces the election of Douglas Pauls, principal materials and process engineer, Rockwell Collins, to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Elected to the position by the chairs and co-chairs of all IPC standards groups, Pauls succeeds Mel Parrish of STI Electronics, Inc. who held the role for IPC’s top standards development oversight committee for the past two years.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for High Reliability Forum

Industry News | 2023-04-17 08:38:56.0

IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.

Association Connecting Electronics Industries (IPC)

LIVE ELECTRONICS ASSEMBLY LINE FEATURED AT ELECTRONICS MIDWEST

Industry News | 2010-09-02 16:09:40.0

Each step in the electronics assembly process will be on display and fully functioning on the show floor at Electronics Midwest, produced by IPC — Association Connecting Electronics Industries® and Canon Communications.

Association Connecting Electronics Industries (IPC)

VIGON® EFM // How To Clean PCBs

VIGON® EFM // How To Clean PCBs

Videos

Precision Cleaning Medium For Manual Flux Removal VIGON® EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. VIGON® EFM is a mixture of halogen-free, organic solvents. It dries fast a

ZESTRON Americas

AIMTERGE 6035 Solder Paste, Flux and Wire Residues Cleaner

AIMTERGE 6035 Solder Paste, Flux and Wire Residues Cleaner

New Equipment | Cleaning Agents

AIMTERGE 6035 cleaner is a saponifier formulated to readily remove resin, rosin, no clean and water soluble flux residues from printed circuit boards, while preventing the attack of components and aluminum hardware common with many saponifers. The re

AIM Solder

How Clean is Clean Enough – At What Level Does Each of The Individual Contaminates Cause Leakage and Corrosion Failures in SIR?

Technical Library | 2016-09-08 16:27:49.0

In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.

Foresite Inc.

MICRONOX MX2708 Organic Acid Residue Cleaning Agent

MICRONOX MX2708 Organic Acid Residue Cleaning Agent

New Equipment | Cleaning Agents

210°F / 99°C Boiling Point: 266°F / 130°C Water Soluble: Complete VOC, @ 10% 90.1 g/L MICRONOX products are semiconductor grade cleaning chemistries for defluxing and particulate removal for the Advanced Packaging, Microelectronics and Semicond

Southwest Systems Technology

Nu/Clean Aqua Batch

Nu/Clean Aqua Batch

Videos

See the Nu/Clean Aqua Batch Aqueous Batch Cleaner in operation! Quick, quiet, close loop cleaning at a great price! For technical specifications, visit our website www.TechnicalDev.com.

Technical Devices Company


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