Used SMT Equipment | Screen Printers
Sku 16540• Year 2007• Came out of a Clean-Room / prototype dept and in Excellent Condition• Manual Optical Positioning (MOPS): Left and Right High Resolution Cameras for Substrate Alignment Reliable Recognition of Fiducials or other layout fea
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Advantages of Magnetic Pallet Alloy material, which has good flatness and is stable in high temperature Using a high-temperature resistant magnet capable withstand reflow or wave soldering temperature. Special magnetic steel sheet, good elastic
New Equipment | Board Handling - Storage
Stentech's Vacuum Plates provide support for the circuit board during the assembly process. Because we now manufacture highly complex and dense boards, this has become critical to avoid warping, sagging, and bending of the board. Vacuum plates wil
Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil technologies on the market
New Equipment | Solder Paste Stencils
Stentech's frame-manufacturing department can make any shape and size according to our customers' needs. Frames can be made of aluminium, steel, plastic and most any kind of material. Frames can be cast, formed, welded, screwed, and/or bolted togethe
Used SMT Equipment | Screen Printers
The MPM Accela printer from Speedline is the ultimate printing solution for manufacturers of high-volume, high-technology applications. Accela processes the largest, thinnest or most complex substrates with unprecedented speed, accuracy and ease. *
Automatic solder paste printer machine for 1200mm PCB Description: LK-F1200 Ideal for LED production which for Accuracy it has built-in ±10 micron alignment,and ±25 micron wet print repeatability (≧2.0Cpk@6sigma) with 20 seconds total throughpu
ITW EAE MPM Edison Printing System
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Industry News | 2008-03-19 14:21:17.0
Essemtec will feature SP003-MLV, a semi-automatic stencil printer with vision for faster control and alignment correction, in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
