Electronics Forum | Wed Mar 07 16:44:43 EST 2007 | realchunks
Well there ya go, this proves you can't engineer from your desk, thru a computer, miles away! I'm also surprised you answered back - most don't. Thanks Mark.
Electronics Forum | Sun Mar 11 19:48:17 EDT 2007 | abjason
There is nothing to argue if you had found Ni above or togather with Gold, definitly you got poor wetness and awful solderbility for sure.
Electronics Forum | Wed Aug 26 20:58:52 EDT 2009 | mika
Hi, Just as DaveF said; please give us some more information. It could be a a´lot of things. For .ex. Do you by any chances solder with Ni/Au at the board?
Electronics Forum | Tue Dec 21 04:09:49 EST 2010 | johanhuizing
0.5 and 0.4 mm pitch, we think we could get problems with the solderpaste stencil. Also some board have keypads and then we have do do partial gold and I think that will not reduce the costs
Electronics Forum | Mon Mar 05 16:16:08 EST 2007 | Mark
Hello, We are having issue with one of the customer board. This is 10 layer PCB FR4 with black solder mask. Coating Ni/Au. Soldering leadfree. We are using 7 zones air reflow oven (zones top&bottom). We have bed solder flowing for this boards. T
Electronics Forum | Mon Dec 06 05:18:53 EST 1999 | Wolfgang Busko
Hi Russ, assuming that only your flux changed and the PCB-finish stayed the same it seems to me that the solderability of that finish is somehow poor. About Ni/Au it can be said that the solderconnection is made between Ni and Sn. The Au-finish is ju
Electronics Forum | Thu Nov 01 04:52:50 EST 2001 | wbu
Hi Brian, yes that�s possible due to the presence of Au in the joint but nothing to worry if the Ni/Au is done properly (means not to much Au in your plating). "rugged" I haven�t noticed yet, that may depend on the definition and maybe the magnifica
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Thu Feb 22 16:40:23 EST 2007 | mika
One of our customers that always was going for Ni/Au surface finish on RoHS PCB and our processs was adjusted for that, "whithout any problem". Recently they decided to switch to another surface finsh: PbFree HASL. What is that? Imersion tin/silver?
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
