Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
New Equipment | Test Equipment
Fast and accurate ionic contamination cleanliness testing. Dynamic testing of ionic contamination is a widely approved and followed standard. So, too, is the equipment that makes it possible - SCS Ionograph®. Available in different models, the SCS
Industry News | 2012-08-20 12:54:45.0
STI Electronics, Incwill present at the upcoming Cleaning and Reliability Workshop, scheduled to take place Thursday, September 13, 2012 at the Holiday Inn Huntsville-Research Park in Huntsville, AL.
New Equipment | Cleaning Equipment
Zero Ion Ionic Contamination Tester Today's Zero Ion is designed to meet the cleanliness testing challenges associated with modern circuit assemblies. The Zero Ion is capable of extracting and quantifying assembly contamination levels per IPC J STD0
Industry News | 2017-11-07 08:35:51.0
blu-SAT Presaturated IPA Cleaning Wipes from Blue Thunder Technologies are available in eleven unique variations. Low-linting and saturated with IPA and DI water, the blu-SAT line consist of options suitable for a variety of controlled environment classes including ISO 3-4, 5 and higher.
Industry News | 2020-04-02 17:00:04.0
Austin American Technology (AAT) is pleased to announce that the HydroJet® was the first inline cleaner to introduce the current standard of coherent jet technology to clean under tightly spaced components. AAT further improved this technology by developing Progressive Energy Dynamics (PED), which is only available on Austin American inline cleaners.
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
New Equipment | Cleaning Agents
IONOX® FCR is a solvent blend designed for removing rosin, low solids and water soluble fluxes while being environmentally friendly. Easy to use, FCR is applied as received. A water rinse is required to remove all traces of soils and cleaner residues
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Industry News | 2011-07-22 23:23:08.0
Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will present at the upcoming technical workshops titled “Cleaning Electronic Assemblies”, that will be held at two separate locations in Texas.
