Electronics Forum | Thu Aug 24 13:18:24 EDT 2000 | Dave F
What are the primary indium (In) / tin (Sn) intermetallic compounds (IMC)? What are the drivers to the formation of In/Sn IMC? Copper / tin IMC are very bittle and, while necessary for proper solder connection formtion, are ment to be minimized. W
Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef
We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b
Electronics Forum | Mon Feb 12 13:58:10 EST 2007 | campos
Tks for the answers,, My concern is about the intermetalic layer,,I run SMQ230 LEAD FREE paste.. its liquidous at 217C..the oven have 7 zone, but I run in 5 zones also with a more agressive profile (due to the line rate)..I would like to know if runn
Electronics Forum | Fri May 03 18:55:41 EDT 2002 | davef
Interesting situation. Everything [ie, intermetallic compounds, solderability, etc] is speculative without knowing more about the materials of: * Leads. * Solderability protection. ... because suppliers use a fairly wide of materials. Your suppl
Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Sun Jun 20 16:45:48 EDT 1999 | Chrys Shea
I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), and
Electronics Forum | Mon Jun 21 15:27:00 EDT 1999 | Tony
| I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), an
Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F
| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl
Electronics Forum | Thu Nov 03 08:18:17 EST 2005 | fctassembly
Hello Arnold, Just to clarify the Sn100C discussion: Please note that SN100C is the Nihon Superior alloy composed of tin/.7copper/nickel. The key point in regard to SN100C is that Cu does not go directly into solution but first reacts to form an inte
Electronics Forum | Tue Jan 30 09:26:59 EST 2007 | CK Flip
I think most people don't "get" soldering, and advocate the "more-is-better" approach as if solder were duct tape - you know...the more duct tape you put on something the stronger the bond. Such is NOT the case with soldering. People don't "get" that
