Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F
| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol
Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef
There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows
Electronics Forum | Mon Mar 16 01:06:25 EST 1998 | Victor Ng
Dear all, Recently I have a problem of non-wetting at our wave soldering process. It appears only on the SMT pads for the chip components (at the solder side) of the HASL PCB. With all the same parameters on the wave soldering machine, i
Electronics Forum | Mon Apr 26 17:45:26 EDT 1999 | Earl Moon
| | | Earl said, in essence: | | | | | | | Justin is absolutely right ... | | | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those
Electronics Forum | Thu Apr 16 13:50:49 EDT 1998 | Lou
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Thu Apr 16 13:47:36 EDT 1998 | Lou
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000
>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with
Electronics Forum | Thu Jun 29 10:38:04 EDT 2000 | John Thorup
Hello Christopher I don't know if there is any kind of official standard but I can tell you that the HADCO DFM manual specifies a nominal thickness of 50-1500u" with an option for 100-1000u" and the Merix DFM manual specifies 30-200u" Our boards (fro
Electronics Forum | Fri Aug 21 07:57:20 EDT 1998 | Earl Moon
| | | Will somebody please explain HASL (here). Thanks. | | Tryin: HASL: Hot Air Solder Leveled. A board fabrication process that applies an oxidation preventing solder coating to copper pads on the board. Dave F | You do this to keep the green s
