Electronics Forum | Wed Sep 14 08:01:44 EDT 2005 | Rob
It's a functional test over a number of hours/days designed to give an accelerated life test, to detect possible faults, intermittants etc. You tend to run the boards in a hotter & harsher environment to reduce the test cycle time.
Electronics Forum | Tue Nov 26 09:05:48 EST 2019 | scotceltic
Thank you for the response. Nothing in the datasheet referring to a percentage of thermal pad coverage. I am thinking along the same lines. We are not failing any thermal or functional testing as is so am thinking there is no problem here except m
Electronics Forum | Sat Mar 10 07:02:23 EST 2007 | imounen
i want to know what is the difference between ICT and functional test.is it mondatary to in ICT to test all components or there is a basic rules ,to know what are things to be tested . thanks ,
Electronics Forum | Tue Jul 25 03:10:05 EDT 2006 | reypal
If your Test tech able to analyze and tell you which exact ball/location is the problem, you may send it for cross section analysis and see how the solder connection behaves. also pls check your ESD implementation.
Electronics Forum | Mon Mar 17 03:50:12 EDT 2008 | Sean
Hi All, Besides the above question, I have another one as below: (1) How frequent that we need to perform strain gauge study on ICT, Functional test fixture? Is it a necessary to perform this study each time after ICT, Funtional test fixture preve
Electronics Forum | Wed Sep 30 08:21:07 EDT 2009 | cunningham
Hi We have a board at the moment thats passing ICT and passing functional test but its failing test after conformal coating has anyone had any experinces of this? or any idea what may be causing this?
Electronics Forum | Mon Aug 27 08:22:39 EDT 2012 | rway
Dan_ems wrote, "I already build such a system with hardware and software from National Instruments. I think is the best solution because you can buy for the start only a Multimeter (DMM), a multiplexer and a software. Is very easy to do the programmi
Electronics Forum | Mon Sep 29 14:47:07 EDT 2008 | ikonify
Have seen similar problem before with regards the MSD being the cause. But also seen similar defects being found at functional test as the in-circuit test was injecting to much current during test. The devices were walking wounded afterwards. The in
Electronics Forum | Thu Nov 07 14:30:38 EST 2002 | Debi Musante
We have been presented with the task of placing a BGA on top of a PGA. The previous process choice was to apply paste directly on the BGA (which failed functional testing) We are considering applying tacky flux (only) on BGA, since this is our first
Electronics Forum | Fri Oct 10 20:44:00 EDT 2003 | stefwitt
Hi Dave, so did I, two years ago. However, I got a brief demo by a former colleague, now representing ART thermal, functional test equipment in Mexico. You may want to contact J�rg at jhbaetzel@yahoo.com
