Electronics Forum: flux outgassing (Page 4 of 5)

Re: Why use Nitrogen ??

Electronics Forum | Fri Jun 12 15:24:30 EDT 1998 | Steve A

| I am looking at purchaseing a full convection bench top oven from OK Industrys. (Model JEM-310) | It seems to have all the features that we will need for low volume production runs. | It has a Nitrogen input option, and I am intrested if anyone on

Re: Wavesolder process characterization

Electronics Forum | Thu Feb 19 12:45:05 EST 1998 | Earl Moon

| I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. | I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and | double-sided boards. Can any

Problem with solder joints in wave solder

Electronics Forum | Tue Jan 21 13:51:19 EST 2014 | rgduval

Armando, Is the problem in the same spot on the board with every run? If so, there might be something about that particular location that is part of the cause (ie. ground or power plane connection). It sounds like you're seeing blow holes, or insu

Re: reliability of epoxy

Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach

| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the

Re: white residue after wash

Electronics Forum | Fri Apr 03 08:22:36 EST 1998 | Scott Cook

| At this moment in time we are using water soluble solder paste on our PCBs these are cleaned using water only, agitated with ultrasonics. After drying a white/grey residue is left around solder joints. Reflow profile is fine and a reliable wash pro

Re: Liquid, Dispensable Solder Mask

Electronics Forum | Tue Mar 21 20:33:09 EST 2000 | Dave F

Shane: We don�t dispense, but we have thought about it. Several points about peelable solder masks in a no-clean (low residue) process: � Beware of latex peelable solder mask with a low res process without extensive testing. The problem is usuall

Re: Reg: Voids in solder bumps

Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen

Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing

Solder Ball Dispersion Test (String Solder)

Electronics Forum | Thu May 03 15:02:59 EDT 2018 | solderingpro

Bob Willis (was the first I knew of) that has a splatter test that can be performed over a ceramic hot plate or the like. The concept is pretty straight forward, using a zoned circle, users can introduce the solder wire at a consistent rate and coun

Re: Qualifying new PWB Vendors

Electronics Forum | Sat Jan 16 02:43:21 EST 1999 | Earl Moon

| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have

Re: reliability of epoxy

Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here

| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t


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