Technical Library | 2023-09-23 22:29:02.0
Moisture trapped within components and PBs presents a serious problem during the fabrication and assembly process. Too much moisture can lead to board failures when it is turned to steam during the reflow process.
New Equipment | Board Handling - Storage
SDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: Model: SDC-1001 Fast Super Dryer Capacity: 657 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% RH within 30 minutes after accessing door for 30 seconds or less. Ex
Technical Library | 2024-01-08 21:31:01.0
The aim of this collection and interpretation is to develop an understanding of moisture in materials, especially in printed circuit boards, to know the effects on further processing and to be able to derive targeted corrective actions when moisture-related problems occur. In principle, the considerations are valid for all types of PCBs. Although these basic principles are of particular importance when working with flexible and rigid-flexible printed circuit boards; observing them can mean the difference between success or failure.
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
All electronic hardware is susceptible to the damaging effects of moisture, temperature, and contaminants. STI understands the criticality of reliability testing and test-to-failure. Improper selection of assembly materials and manufacturing processe
Technical Library | 2015-03-26 19:16:03.0
Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals. The mixed flowing gas test has been demonstrated to produce creep corrosion on parts with nickel-palladium-gold finished terminals. Conformal coats are often used to protect printed wiring assemblies from failure due to moisture and corrosion. However, coating may not be sufficient to protect lead terminations from failure.In this study, acrylic, silicone, urethane, parylene, and atomic layer deposit (ALD) coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals.
Industry News | 2011-12-30 23:20:54.0
SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that it will host a workshop titled Handling Moisture-Sensitive Components & PCBs Without Failure on Wednesday, January 25, 2012 at the Stoke Mandeville Stadium in Aylesbury, Buckinghamshire, UK.
New Equipment | Coating Materials
Parylene is a green chemistry, which is self-initiated (no initiator needed) and un-terminated (no termination group needed) with no solvent or catalyst required. Parylene is applied to electronic circuitry, medical devices, aerospace applications,
Technical Library | 2020-08-13 01:12:57.0
The solar industry has driven solutions that result in electronics systems that are required to perform in outside environments for over 25 years. This industry expectation has resulted in solutions to protect the electronics from failure that can result from interaction with moisture, and various chemicals leading to corrosion and shorting of the systems. Potting and encapsulation compounds can impart the very high level of protection from environmental, thermal, chemical, mechanical, and electrical conditions that the solar applications demand.
Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
