Electronics Forum | Fri Apr 02 02:01:24 EST 1999 | P.L. Sorenson - Technical Consultant
| | | Has anyone heard of a problem with catastrophic failure of | | | large value (200uF) solid tantulum capacitors that have been | | | exsposed to high humdity. | | | | | I suppose that with water moisture seep in the capacitor, the risk is ver
Electronics Forum | Fri Aug 22 09:49:31 EDT 2003 | davef
Ask your supplier for a corrective active and failure analysis of the boards. In parallel, send the boards to a failure analysis laboratory to determine the material on your gold pads. Take your work to another supplier.
Electronics Forum | Wed Mar 04 08:25:49 EST 2009 | scottp
I don't think anyone can give you an answer until you've had some failure analysis done. Silver migration? Dendritic growth? Tin whiskers? Lots of possibilities, but you won't know without failure analysis.
Electronics Forum | Wed Oct 16 01:28:45 EDT 2002 | redmary
during the failure analysis, how to etch the tin,nickle,and copper?
Electronics Forum | Fri Jan 07 07:34:34 EST 2011 | scottp
What failure analysis have you done to know that the solder isn't melting?
Electronics Forum | Fri May 21 12:13:11 EDT 2010 | davef
Failure Modes and Effects Analysis (FMEA): http://en.wikipedia.org/wiki/Failure_mode_and_effects_analysis
Electronics Forum | Tue Nov 24 13:55:17 EST 1998 | trien pham
I have a COB device that I need to decapsulate for failure analysis. I would like to find out how I can do it using common materials/process that I can easily find. Thank you and I look forward to hearing from you soon.
Electronics Forum | Wed Mar 19 09:59:45 EST 2003 | davef
Jodi What's your thinking on the black pad rework technique proposed in: �A Failure Analysis And Rework Method �� Z. Mei, et al, SMTA International 1999, p407
Electronics Forum | Mon Jul 07 23:27:41 EDT 2003 | MA/NY DDave
Hi Sam, I am going to guess that a problem is being caused by processing to effect the inside of the LED package. Send some failed LEDs back to the manufacturer to do a failure analysis. Also ask the manufacturer for info on their SMT processing q
Electronics Forum | Mon Oct 13 14:12:10 EDT 2003 | davef
PTH DIP that have been prepped to become SM can be very unreliable, depending on how the part is prepped. Consider asking your customer to do a failure analysis of those solder connections.
