Electronics Forum | Thu Aug 24 13:31:55 EDT 2000 | Dave F
At room temperature, how long does it take for the phases of a common tin (Sn) / lead (Pb) solder, say 60/40, to reach equilibrium? While the materials are diffusing toward equilibrium do the material properties of the solder change significantly?
Electronics Forum | Thu Dec 06 18:23:01 EST 2001 | stefwitt
It has been done and I could set you up with some customers, who continue to place BGA's on the HS 180 successfully. In the GF editor you define the component as if it had leads around the perimeter. At the end of the editor you activate outline meas
Electronics Forum | Fri Apr 25 17:03:34 EDT 2003 | davef
Leaching. Dissolution of a metal coating into liquid solder. Leaching applies to liquid solder and, at times, is applied inaccurately to metallurgical effects, like diffusion, that occur after the solder has solidified. Please help us understand y
Electronics Forum | Wed Apr 07 10:10:00 EDT 2004 | ccl
thanks Dave, solder mask use is AUS 5 from Taiyo ink, solderability of the contam area is still pass the min spec. gold thickness is ~ 1 um and Ni layer is ~10um. can solder mask bleed cause contam? forget to tell the product is full body gold (FBG)
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
Electronics Forum | Mon Feb 19 08:00:46 EST 2007 | ck_the_flip
Darby, thanks for the good info. I actually read an article is Circuits Ass'y that a more rapid cooling rate results in "better diffused tin rich clusters" resulting in better grain structure. But...this article was written by an Oven manfuacturer
Electronics Forum | Tue May 05 07:04:25 EDT 2015 | anirudh_thabjul
Hi Everyone, I have done with my PCB Prototyping. I want to send my Bare Board for Components assembly. So, I need to order the respective components for my assembly. Can anyone suggust me a good electronic distributor in France or Europe. Re
Electronics Forum | Sat Feb 20 09:41:51 EST 1999 | Andy
| We are using .040" diameter fiducials (global and local) on our boards. They are solder covered and HASL. I get batches of boards where the p&p vision system has trouble reading the fiducial. The fiducial looks dark on the screen. The board ven
Electronics Forum | Thu Feb 07 09:07:10 EST 2002 | fmonette
Dason, Please be aware that weight gain is only a very crude estimate of the component moisture content. This is only accurate when the moisture is uniformly distributed inside the component (which is actually never). This measurement is usually no
Electronics Forum | Tue Jun 01 10:11:00 EDT 2004 | davef
Intermetallic growth is a diffusion process, the thickness of the intermetallic is given by: z^2 = (Do)(t)exp[-Q/RT] Where Do (m2 s-1) is the diffusion coefficient, T(�K) is the temperature, Q (J mol-1) is the activation energy and R (8.314 J mo
