Technical Library | 2013-04-18 16:46:42.0
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons: to protect from moisture and contamination, to minimize dendritic growth, to provide stress relief, and for insulation resistance. These contribute to more durable handling, enhanced device reliability, and reduced warranty costs. Increased miniaturization of new circuit board designs requires flexible, low stress coating material to protect delicate components and fine-pitch leads. Silicone conformal coatings offer many advantages that address the general trend of ongoing PCBs designs, such as: high flexibility and low modulus to reduce stress on delicate or small components... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Industry News | 2021-02-25 13:41:10.0
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
Industry News | 2023-10-09 09:17:14.0
Koh Young Technology will discuss the increasingly significant role of data collection and analysis to enable Generative Artificial Intelligence (GenAI) functionality to improve productivity in our industry. On 16 October during the one-day SMTA Ontario Technical Conference, Joel Scutchfield, General Manager of SMT Business Operations and Director of Sales at Koh Young America will discuss how electronics manufacturers can boost efficiency, improve flexibility, and even achieve self-optimizing processes.
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Features: ▲ Patented Heating Wire Heating Technology, Independent Micro-Circulation Wind Design, Upper And Lower Heating Mode, Good Thermal Compensation, High Thermal Efficiency, Power Saving, Fast Heating Speed, It Is Especially Suitable For Welding
PCBA , Printed Circuit Board Assembly, PCB Assembly , EMS pcba, Electronic Manufacturing OEM PCBA Tronixlink PCB Assembly line includes the latest process in SMT and wave soldering along with SIP, AOI, X-ray, ICT and functional testing. Our SMT capab
Industry News | 2011-09-21 13:21:51.0
Essemtec will showcase flexible Swiss-made solutions in Booth #127 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2010-06-11 13:09:30.0
São Paulo, Brazil — Trafalgar Publications Ltd., a global media provider of high-technology exhibitions, conferences and publications, announces a world-class program of training workshops at GEM Expo 2010, which is scheduled to take place October 5-7, 2010 at the prestigious, state-of-the-art Expo Center Norte in São Paulo, Brazil.
Industry News | 2021-01-17 17:50:26.0
The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
Industry News | 2012-10-09 15:47:21.0
Essemtec, announces that it will highlight Paraquda, its industry-leading, flexible, Swiss-made pick-and-place solution in Booth #520 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 16-17, 2012 at the Walt Disney World Dolphin Hotel in Orlando, FL.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
