Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Used SMT Equipment | Soldering - Reflow
The latest breakthroughs associated with the Mark 5 reflow system now provide you with an even lower cost-of-ownership. Heller's new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5
New Equipment | Design Services
With our well-equipped environmental and test laboratories, we can assist customers in developing and validating reliability models to simulate product lifetimes and field failures for their products. ACI utilizes Environmental Stress Screening (ESS
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Industry News | 2015-08-16 09:43:18.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
