Technical Library: cleaning (Page 4 of 11)

Stencil Cleaning Handbook

Technical Library | 2022-08-17 01:21:54.0

Back in the "good old days," stencil cleaning was effortless and effective. CFC-based solvents were sprayed or wiped onto a stencil with apertures hundreds of times larger than modern-day components. The stencil cleaning process was not considered a value-added procedure; instead it was the cleaning of a production tool. How times have changed. The late-1980s ushered in the end of most of the popular solvents, and the machines that consumed them. Assemblers turned to alternative cleaning agents, including IPAs and other solvents.

Aqueous Technologies Corporation

Evaluation of Under-Stencil Cleaning Papers

Technical Library | 2016-08-04 14:33:23.0

Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen printing is the under stencil cleaning process and one of the key materials in this process is the cleaning paper1. This, often neglected, material affects the cleaning process and thereby also the print quality. It is therefore important to perform tests of different cleaning papers before one could be chosen. This article describes how cleaning papers can be tested and it also tells how big differences it can be between different materials.

Ericsson AB

Compatibility of Cleaning Agents With Nano-Coated Stencils

Technical Library | 2013-03-12 13:25:18.0

High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils

KYZEN Corporation

Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware

Technical Library | 2016-07-28 17:00:20.0

Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.

KYZEN Corporation

What Cannot Be Cleaned In a Stencil Cleaner

Technical Library | 2009-09-18 14:48:58.0

The stencil cleaner can be one of the most versatile tools on the manufacturing floor. It can be used to clean electronic modules in various stages of the manufacturing process. In fact, an automated stencil cleaner can clean just about anything you come up against in your PCB assembly process.

Austin American Technology

The Reasons for Cleaning

Technical Library | 2021-06-28 20:43:32.0

This book is a compilation of many articles I have published on the subjects of cleaning, reliability, and cleanliness testing. Throughout these articles, I promote a common mantra: Clean is better than dirty. Less contamination is better than more contamination. Some assemblies can tolerate more contamination; others, less.

Aqueous Technologies Corporation

Manufacturing Considerations When Implementing Voc-Free Flux Technology

Technical Library | 1999-05-07 11:44:26.0

In 1990 the United States Environmental Protection Agency Issued the Clean Air Act. The Clean Air Act and subsequent amendments are designed to limit the use of chemicals that contain volatile organic compounds (VOCs). The document goes into great detail setting limits for allowable VOC emissions for different industries.

Kester

Using Hansen Space to Optimize Solvent Based Cleaning Processes for Manufacturing Electronic Assemblies.

Technical Library | 2009-07-09 17:23:07.0

Sometimes you just cannot clean with water. Good examples of this are: circuits with batteries attached, cleaning prior to encapsulation, ionic cleanliness testing, and non-sealed or other water sensitive parts. High impedance or high voltage circuits need to be cleaned of flux residues and other soils to maximize performance and reliability and, in these types of circuits; water can be just as detrimental as fluxes. When solvent cleaning is called for, Hansen solubility parameters can help target the best solvent or solvent blend to remove the residue of interest, and prevent degradation of the assembly being manufactured. In short, using this approach can time, manufacturing cost and reduce product liability.

Austin American Technology

Environmentally Certified Technologies: A Case Study

Technical Library | 2000-06-21 17:55:59.0

There was once a time when precision cleaning required minimal thought. Just about anything that was dirty could be placed inside a vapor degreaser and emerge clean and dry in a matter of minutes. Today, precision cleaning decisions are seemingly endless with ever-changing environmental regulations, user safety issues and product compatibility concerns. Technologies range from spray-in-atmosphere to ultrasonics to spray under immersion using aqueous, solvent or semiaqueous chemistries. Which method works and with what chemistry? Will the process be safe or even allowed by the regulating agencies?

Smart Sonic Stencil Cleaning Systems

Stencil Cleaning - A Practical Approach To Improving Yields And Maximizing Your Throughput

Technical Library | 2021-11-10 20:07:46.0

Main Points * Technologies for the job * More than a flat piece of Stainless * Compatibility * Solubility in stencil cleaning * Influencing factors * Best Practices to reduce misprints and increase yields

KYZEN Corporation


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