Industry News: cavities (Page 4 of 12)

Techcon Systems Introduces New Positive Displacement PC Pump

Industry News | 2016-10-20 20:04:53.0

Techcon Systems is pleased to announce the introduction of the new TS8100 Series Positive Displacement PC Pump. The continuously volumetric dispense pump is based on Progressive Cavity (PC) technology.

Techcon Systems

Techcon Systems to Display New Positive Displacement PC Pump at The ASSEMBLY Show in Rosemont

Industry News | 2016-10-24 16:09:49.0

Techcon Systems will exhibit in Booth #345 at The ASSEMBLY Show, this week from Oct. 25-27, 2016 in Rosemont, IL. The team will demonstrate the new TS8100 Series Positive Displacement PC Pump, along with its dispensing robots. The continuously volumetric dispense pump is based on Progressive Cavity (PC) technology.

Techcon Systems

DEK and Gore Introduce snapSHOT� Board-Level EMI Shielding Solution

Industry News | 2003-02-14 08:03:50.0

Provides Devices with Excellent Protection Against EMI and Overcomes Limitations of Metal Cans

ASM Assembly Systems (DEK)

Murata Launches World’s First Ultra-Thin Waterproof Piezoelectric Speaker - Product Meets Rising Demand In Mobile Equipment Market

Industry News | 2010-08-26 20:29:20.0

Murata Electronics North America today announced the launch of the world’s first ultra-thin waterproof piezoelectric speaker. With a thickness of only 0.9mm, this 19.5mm x 14.1mm speaker enables greater design freedom for the rapidly growing and evolving mobile market.

Murata Manufacturing Co., Ltd.

Essemtec to Introduce Its High-Speed Jetter to North America at SEMICON West

Industry News | 2013-05-21 10:35:48.0

Essemtec, will introduce the Scorpion high-speed jetter in booth #6766 at the upcoming SEMICON West, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco.

ESSEMTEC AG

Essemtec to Introduce Its High-Speed Jetter to North America at SEMICON West

Industry News | 2013-06-06 19:02:51.0

Essemtec, will introduce the Scorpion high-speed jetter in booth #5567 at the upcoming SEMICON West, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco.

ESSEMTEC AG

Essemtec Wins Award for High Speed-Jet Dispenser during Productronica

Industry News | 2013-11-12 16:23:50.0

Essemtec announces that it was awarded a 2013 Global Technology Award in the category of Dispensing Equipment for its Scorpion high-speed jet dispenser.

ESSEMTEC AG

Techcon Systems to Display New Positive Displacement PC Pump at the IPC APEX EXPO

Industry News | 2017-01-11 18:53:22.0

Techcon Systems will exhibit in Booth #1500 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The Techcon team will demonstrate the new TS8100 Series Positive Displacement PC Pump with the TS500R-PC, along with its TSR2000 Bench Top Robot Series.

Techcon Systems

Essemtec Wins NPI Award for Tarantula All Terrain Jet Dispenser

Industry News | 2018-02-28 08:22:00.0

Essemtec has been awarded a 2018 NPI Award in the category of Dispensing for its Tarantula – Relentless All Terrain Jet Dispenser. The system features state-of-the-art technology and can be easily integrated in any line. It is designed for a wide range of dispensing applications such as solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.

ESSEMTEC AG

Techcon Demonstrates Smart Dispensing Robots at NEPCON Asia

Industry News | 2019-08-13 06:43:28.0

Techcon today announced plans to exhibit at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. The company will showcase its TS8100 Series Progressive Cavity Pump, TS5000DMP-DCX Auger Valve, Smart Valve Controller Series and TSR2000 Smart Dispensing Robots in Booth 1E25. Additionally, attendees will be the first to preview the new Techcon Jet Valve and Controller, scheduled to launch later this year.

Techcon Systems


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