Electronics Forum | Sun Dec 02 22:00:21 EST 2007 | shy
The idea for solder at bottom side is for component such as SOIC, QFP and chip. This solder is needed since not entire bottom component had glue. that's why we're combining both solder paste and glue and reflow at the same time.
Electronics Forum | Thu Nov 29 22:31:27 EST 2007 | shy
Hi Stephen, The component falling off is the component that had glue. the component witout glue is being covered by masking during wave. What is the meaning by populated the part and cure it? is it run with solder paste profile or glue profile or yo
Electronics Forum | Fri Nov 23 07:51:25 EST 2007 | shy
Hi there, kindly help to advice me either epoxy/glue at bottom SMT component such as chip package 2012 will cause the component to be non-wetting after run reflow process?
Electronics Forum | Mon Dec 03 02:23:12 EST 2007 | lococost
yigh, loose the glue, put paste on ALL bottom SMD components and cover ALL SMD components with peel off before wave.
Electronics Forum | Sun Nov 25 20:36:15 EST 2007 | shy
Hi Devaf, Sorry to make unclear statement earlier. I believe the issue that i'm trying to discuss is regarding the adhesive that place beneath (center) the component to prevent it from drop during wave soldering process. Normally the component pack
Electronics Forum | Tue Nov 27 07:44:59 EST 2007 | davef
We do not paste when we glue. We glue components so they will stay inplace during wave soldering. In wave soldering there is ample solder to bridge the standoff between the component and the pad.
Electronics Forum | Mon Dec 03 02:44:27 EST 2007 | shy
Hi Loco, If i cover all the SMT component with peel off before reflow, it'll increasing downtime at my production site. To reduce the downtime, we had idea to add in the glue for component package 0805 and bigger.
Electronics Forum | Thu Nov 29 13:05:46 EST 2007 | stepheniii
I really hate to ask but must. Are the components that are falling off, the components that don't have glue? Seriously not all the parts on the bottom are glued on? How do they stay on during the wave? The normal way is to run the top SMT as normal
Electronics Forum | Tue Nov 27 07:36:29 EST 2007 | shy
solder the part is for SMT component (located at top side and bottom side) and wave solder is for THP (located at top side only).
Electronics Forum | Mon Nov 26 21:41:09 EST 2007 | davef
Shy: Oh, we NOW understand what you're asking. Sorry to be so dense. We agree that the standoff of component from the board could end-up being a little heigher than the pad height when using chipbonder adhesive. We rarely see a problem.
