Industry News | 2010-03-27 17:37:02.0
TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will feature its leading machinery in booth 407 at the upcoming IPC/APEX conference and exhibition.
Industry News | 2013-01-17 09:22:05.0
FCT Assembly announces that it will highlight its new NanoSlic™ Multilayer Coating for the first time in booth #2627 at the upcoming IPC APEX EXPO
Industry News | 2023-09-25 20:39:50.0
StenTech® Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo, scheduled to take place Oct. 25-26, 2023 at the Expo Guadalajara in Guadalajara, Jalisco, Mexico. This year's exhibition promises to be a game-changer as StenTech unveils its latest capabilities, including a state-of-the-art laser system and award-winning Advanced Nano Coating in Booth 920.
Industry News | 2023-10-31 19:19:30.0
StenTech® Inc. today announced that it received an esteemed 2023 Mexico Technology Award in the category of Screen/Stencil Printing Consumables. The award celebrates StenTech's revolutionary Advanced Nano Coating, a groundbreaking technology that sets a new benchmark for stencil performance and precision. The award was announced at a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
Electronics Forum | Fri Jul 13 19:08:55 EDT 2001 | mparker
Home plate apertures are designed to reduce or eliminate solder balls that occur when placing a chip and reflow of the solder. This aperture type is usually desired when processing with a "no-clean" solder paste. The design of the aperture is usually
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Tue Sep 20 23:12:38 EDT 2005 | darby
Several suggestions. Your hands may be tied but here goes. 1. Doctor your stencil so that pads are not shared etc and reduce the apertures more that what you would normally. This may stop one pad wetting into another etc. 2. The use of a Pb-free sol
Electronics Forum | Thu Mar 06 10:57:28 EST 2003 | Mark
What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. And direction of squeegee print over the aperture? Recommended Stencil thickness? Recommended aperture reductions? Recommended pcb pad sizes? Recommended
Electronics Forum | Fri Mar 07 14:09:16 EST 2003 | davef
Q1: What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. A1: We've talked about this previously here on SMTnet, for instance check the fine SMTnet Archives: http://www.smtnet.com//forums/index.cfm?fuseactio
Electronics Forum | Fri Mar 07 21:02:21 EST 2003 | neil
When printing below .5mm pitch, the recommended stencil thickness is 5Thou, laser cut. Do not use any reduction and ensure wherever possible the pad to space ration is 1:1, the length of the pad is not as important as the gap between adjacent pads. T
