New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Electronics Forum | Wed Jan 03 18:44:13 EST 2001 | Todd Koeppel
If we procure parts with a Sn/Ag termination, can we still use standard Sn/Pb solder pastes and the current reflow and wave processes?
Electronics Forum | Thu Jan 27 14:49:53 EST 2000 | Glenn Robertson
Tuan - One of the reasons I suggested pre-tinning (aside from the negative effects of Gold on appearance and reliability) is the known slower wetting of Sn/Ag and Sn/Cu alloys as compared to Sn/Pb. If you don't have to be Lead-free, the high Lead
Electronics Forum | Mon Mar 08 11:42:05 EST 2004 | Jay
Sn-Ag, Sn-Sb, and Sn-Cu based lead free alloys have a higher melting point than that of Sn-Pb eutectic system. Thus, it will be better if you can use a higher TG PCB for lead free purpose. But, also most of commercial products including SAC can be
Electronics Forum | Sat Jan 06 10:27:07 EST 2001 | Dave F
This is a very timely topic, as we drift [buffeted by the combined wind of everyone down-stream in the supply chain ] on waves carrying all of us from the land of lead to the land of no-lead. I want to say there was a recent trade journal article pu
Electronics Forum | Thu Jun 05 16:44:19 EDT 2003 | blnorman
The data we have is from an IBM report. Below 100�C the SAC reliability is almost double that of SnPb (-40 to 100�C thermal cycle). When the upper end temp is increased to 125�C the reliability drops to 75% of SnPb. I'd like to see the data that s
Electronics Forum | Wed Aug 31 03:35:41 EDT 2005 | Slaine
I have a through hole product that is currently built with HMP solder(93.5Pb,5Sn,Ag1.5). We then dip it in 60/40 SnPb to give a solderable finish as HMP tends to oxidise. We need the HMP as our Customers solder through reflow ovens. Some customers w
Electronics Forum | Thu Oct 07 16:57:02 EDT 1999 | Glenn Robertson
| | I have a board, 4 spacers needed to be soldered on the board | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there wi
Electronics Forum | Fri Oct 08 08:26:03 EDT 1999 | Carol Zhang
| | | I have a board, 4 spacers needed to be soldered on the board | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, ther
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
