1.5M LED board conveyor|PCB linking conveyor|PCB inspection station for SMT assemblyhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/177.html ASCEN major for the PCB conveyor and the PCB magazine loader &unloader,PCB depaneling mac
1.5M LED board conveyor|PCB linking conveyor|PCB inspection station for SMT assemblyhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/177.html ASCEN major for the PCB conveyor and the PCB magazine loader &unloader,PCB depaneling mac
1.5M LED board conveyor|PCB linking conveyor|PCB inspection station for SMT assemblyhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/177.html ASCEN major for the PCB conveyor and the PCB magazine loader &unloader,PCB depaneling mac
1.5M LED board conveyor|PCB linking conveyor|PCB inspection station for SMT assemblyhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/177.html ASCEN major for the PCB conveyor and the PCB magazine loader &unloader,PCB depaneling mac
Industry News | 2011-01-12 17:40:04.0
Check out these Show Highlights, Ways to Save, Networking and Educational Opportunities, and Exhibition Preview.
Industry News | 2013-02-20 18:54:10.0
IPC — Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center.
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a highquality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board a
.gif)
