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SMT On-line 3D Solder Paste Inspection

SMT On-line 3D Solder Paste Inspection

New Equipment | Inspection

SMT On-line 3D Solder Paste Inspection ​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in

Dongguan Intercontinental Technology Co., Ltd.

SMT On-line 3D Solder Paste Inspection ?

SMT On-line 3D Solder Paste Inspection ?

Videos

SMT On-line 3D Solder Paste Inspection ​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in

Dongguan Intercontinental Technology Co., Ltd.

3D SPI Offline Machine T-3010a

3D SPI Offline Machine T-3010a

New Equipment | Inspection

Features: 1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. 2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating m

ShenZhen Sinic-Tek Vision Technology Limited

Akrometrix LLC to Demonstrate Real-Time Analysis, Array Generation (wafer partitioning), and 2D/3D Interface Analysis Software at productronica, U.S. Pavilion Hall A3, Booth 112/1

Industry News | 2015-10-22 16:56:59.0

Akrometrix LLC will exhibit in Hall A3, Booth 112/1 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Company representatives will exhibit Akrometric’s TherMoire’ AXP modular metrology platform which provides shadow moire’, digital fringe projection, and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

Akrometrix LLC Will Discuss Thermal Warpage and Strain Metrology at APEX

Industry News | 2016-02-17 16:31:00.0

Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos

Industry News | 2016-02-18 19:59:51.0

Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

3D SPI  Online Machine S8080

3D SPI Online Machine S8080

New Equipment | Inspection

Features: 1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. 2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating m

ShenZhen Sinic-Tek Vision Technology Limited

Sinic-Tek  3D SPI Online Machine  L1200

Sinic-Tek 3D SPI Online Machine  L1200

New Equipment | Inspection

Features: 1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. 2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating m

ShenZhen Sinic-Tek Vision Technology Limited

Sinic-Tek  High-Speed Inline SPI

Sinic-Tek High-Speed Inline SPI

New Equipment | Inspection

High Precision Online 3D Solder Paste Inspection Features: 1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. 2.Using PSLM technology, changed the traditional way of generating 3

ShenZhen Sinic-Tek Vision Technology Limited

Sinic Tek 3D SPI Machine S450

Sinic Tek 3D SPI Machine S450

New Equipment | Test Equipment

Sinic Tek 3D SPI Machine S450 Dual lane AOI PCB size:50x60-330x330mm Dimension:​850x1430x1500mm weight:850KG Product description: Sinic Tek 3D SPI Machine S450 Sinic Tek 3D SPI Machine S450 Specifications: Product’s parameter

Flasonsmt Co.,ltd


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