Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Industry News | 2023-04-19 17:43:01.0
As spring blossoms arrive and everything comes to life, HELLER Shanghai continues to grow and expand its capabilities in R&D, manufacturing, and customer support. In order to better serve its customers in China and around the world, and to meet future challenges and opportunities, HELLER China has moved to a new location after 21 years at their previous facilities in Shanghai.
New Equipment | Rework & Repair Equipment
Stainless Steel Brush (SH-60) 2 5/16" Made of over 300 long, fine, stainless steel bristles. Use to clean flux from solder joints, clean flux and adhesive from solder pad and for general cleaning purposes. Available in Standard and Miniature
New Equipment | Rework & Repair Equipment
Made of over 300 long, fine, stainless steel bristles. Use to clean flux from solder joints, clean flux and adhesive from solder pad and for general cleaning purposes. Available in Standard and Miniature sizes. Stainless Steel Brush (3 1/2"
Industry News | 2023-11-13 12:28:17.0
MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2015-11-12 20:58:32.0
MIRTEC and YXLON jointly received a 2015 Global Technology Award in the category of Software – Production for the new SmartLoop yield improvement system. The award was presented to the companies during a ceremony on Tuesday, Nov. 10, 2015 that took place at the Messe München exhibition center in Munich, Germany during Productronica.
Industry News | 2015-09-30 16:50:32.0
MIRTEC and YXLON were awarded Best Innovation by SMT Today Magazine for the joint development of the SmartLoop yield improvement system during the recent SMTA International Conference & Exhibition. The award was presented to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division, and Keith Bryant, Sales Director for SmartLoop, on Tuesday, September 29, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The ‘Best Innovation Award’ recognizes clear visionary and transformative technology within the electronics manufacturing industry. This award showcases innovations that have not only addressed a need and solved a problem, but have also been used to drive improved efficiency and productivity of an organization.
