Full Site - : electroless copper (Page 1 of 12)

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

BICHENG Mixed material PCB

BICHENG Mixed material PCB

Parts & Supplies | Circuit Board Assembly Products

1). FR-4 Tg 170 + Rogers 4350B 2). 290*130mm/1up 3). 6 layers at 1.6mm thick 4). Green solder mask/White ident 5). 35um copper finished, ED copper. 6). Electroless gold. 7). Countersunk slots.

Bicheng Enterprise Company

Qualification and Reliability of Microvias

Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,

Qualification and Reliability of Microvias

CALCE Center for Advanced Life Cycle Engineering

Florida CirTech Inc.

Industry Directory | Manufacturer

A specialty chemical and material manufacturer catering to the bare board PCB industry. The company offers a wide range of chemical products that range from Photoresist strippers to Electroless Copper to a variety of final finish products.

Florida CirTech Introduces CK300 � Catalyst Killer

Industry News | 2008-10-29 17:30:39.0

Greeley, CO � October 2008 � Florida CirTech Inc., a leading chemical blender to the Printed Circuit and Electronic Assembly industry, announces that it recently developed the CK300 - Catalyst Killer.

Florida CirTech Inc.

SD 295X Series - Peelable Solder Mask

SD 295X Series - Peelable Solder Mask

New Equipment | Solder Materials

A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection

Atotech

Developments in Electroless Copper Processes to Improve Performance in amSAP Mobile Applications

Technical Library | 2020-09-02 22:02:13.0

With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications

Atotech

Remtec, Inc.

Industry Directory | Manufacturer

US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).

Custom Components

Custom Components

New Equipment | Components

At Barry: custom requests are common and welcome. We enjoy the challange. Extensive capabilities, wide material selection and state-of-the-art equiptment (including in-house plating and machining) ensure we can deliver a component fitting your exact

Barry Industries, Inc.

LABTECH MICROWAVE ATTAINS ISO 14001 ENVIRONMENTAL RE ACCREDITATION

Industry News | 2008-01-28 23:15:36.0

Labtech Microwave, one of the UK’s leading manufacturers of microwave solutions has attained ISO 14001 re accreditation, with the aim of continuously developing the company’s environmental working practices.

Labtech Microwave


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