Industry News | 2015-11-12 20:58:32.0
MIRTEC and YXLON jointly received a 2015 Global Technology Award in the category of Software – Production for the new SmartLoop yield improvement system. The award was presented to the companies during a ceremony on Tuesday, Nov. 10, 2015 that took place at the Messe München exhibition center in Munich, Germany during Productronica.
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Industry News | 2023-10-16 12:50:01.0
MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!
Industry News | 2023-08-22 06:02:56.0
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD
The PCB inspection Vision Measuring Machine is based on the CCD digital image, which is based on the computer screen measurement technology and the powerful software capability of space geometry operation. After installing special control and gr
Parts & Supplies | Pick and Place/Feeders
KE-2060 can place a wide range of components from 0603 and ICs, to odd-form, all at a high rate of speed. 12,500CPH?chip (laser centering/effective tact) 1,850CPH: IC (vision centering/effective tact), 3,400CPH with MNVC option. One multi-nozzle
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Industry News | 2021-02-15 14:41:46.0
– The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
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